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Tissues and organs contain an extracellular matrix (ECM). In the case of blood vessels, endothelium cells are anchored to a specialized basement membrane (BM) embedded inside the interstitial matrix (IM). We introduce a multi-structural collagen-based scaffold with embedded microchannels that mimics in vivo structures within vessels. Our scaffold consists of two parts, each containing two collagen layers, i.e., a 3D porous collagen layer analogous to IM lined with a thin 2D collagen film resembling the BM. Enclosed microchannels were fabricated using contact microprinting. Microchannel test structures with different sizes ranging from 300 to 800 µm were examined for their fabrication reproducibility. The heights and perimeters of the fabricated microchannels were ~20% less than their corresponding values in the replication PDMS mold; however, microchannel widths were significantly closer to their replica dimensions. The stiffness, permeability, and pore size properties of the 2D and 3D collagen layers were measured. The permeability of the 2D collagen film was negligible, making it suitable for mimicking the BM of large blood vessels. A leakage test at various volumetric flow rates applied to the microchannels showed no discharge, thereby verifying the reliability of the proposed integrated 2D/3D collagen parts and the contact printing method used for bonding them in the scaffold. In the future, multi-cell culturing will be performed within the 3D porous collagen and against the 2D membrane inside the microchannel, hence preparing this scaffold for studying a variety of blood vessel–tissue interfaces. Also, thicker collagen scaffold tissues will be fabricated by stacking several layers of the proposed scaffold. [ABSTRACT FROM AUTHOR]

Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (ICs) is recognized as a promising method of extending Moore law progression in electronic components and systems. Since the U.S. Defense Advanced Research Projects Agency launched Intra/Inter Chip Enhanced Cooling thermal packaging program, the method of using microfluidic cooling in 3D ICs has been under continuous development. This paper presents an analysis of all publications available about the microfluidic cooling technologies used in 3D IC thermal management, and summarized these research works into six categories: cooling structure design, co-design issues, through silicon via (TSV) influence, specific chip applications, thermal models, and non-uniform heating and hotspots. The details of these research works are given, future works are suggested. [ABSTRACT FROM AUTHOR]

The rising global need for clean water highlights the importance of efficient sample preparation methods to separate and wash various contaminants such as microparticles. Microfluidic methods for these purposes have emerged but they mostly deliver either separation or washing, with very low throughputs. Here, we investigate parallelization of a curved-channel particle separation and washing device in order to increase its throughput for sample preparation. A curved microchannel applies inertial forces to focus larger 10 µm microparticles at the inner wall of the channel and separate them from smaller 5 µm microparticles at the outer wall. At the same time, Dean flow recirculation is used to exchange the carrier solution of the large microparticles to a clean buffer (washing). We increased the number of curved channels in a stepwise manner from two to four to eight channels in two different arraying designs, i.e., rectangular and polar arrays. We examined efficient separation of target 10 µm particles from 5 µm particles, while transferring the larger microparticles into a clean buffer. Dean flow recirculation studies demonstrated that the rectangular arrayed device performs better, providing solution exchange efficiencies of more than 96% on average as compared to 89% for the polar array device. Our 8-curve rectangular array device provided a particle separation efficiency of 98.93 ± 0.91%, while maintaining a sample purity of 92.83 ± 1.47% at a high working flow rate of 12.8 mL/min. Moreover, the target particles were transferred into a clean buffer with a solution exchange efficiency of 96.81 ± 0.54% in our 8-curve device. Compared to the literature, our in-plane parallelization design of curved microchannels resulted in a 13-fold increase in the working flow rate of the setup while maintaining a very high performance in particle separation and washing. Our microfluidic device offers the potential to enhance the throughput and the separation and washing efficiencies in applications for biological and environmental samples.