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This paper presents a two-axis AlScN-based water-immersible MEMS mirror fabricated in an 8-inch MEMS process. Compared with other studies, this device has a larger optical aperture 10 mm in diameter. The resonant frequencies of the device are 1011 Hz in air and 342 Hz in water. The scanning angle reaches ±5° and ±2° at resonant frequencies in air and water, respectively. The cavitation phenomenon is observed when the device is operating in water, which leads the device to electrical failure. To address this issue, a device with reduced resonant frequencies—246 Hz and 152 Hz in air and water—is characterized, through which the bubbles can be effectively prohibited. This MEMS mirror could potentially be used in ultrasound and photoacoustic microscopy applications.

In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by Cu plating, and detected the final structure and electric properties of the TSVs. The Si through-hole array was fabricated in an 8-inch Si substrate as follows: First, a blind Si hole array was formed by the Si deep reactive etching (DRIE) technique using the Bosch process, but with the largest width of the top scallops reduced to 540 nm and the largest notch elimidiameternated by backside grinding, which also opens the bottom ends of the Si blind holes and forms 500-μm-deep Si through holes. Then, the sidewalls of the Si holes were further smoothed by a combination of thermal oxidation and wet etching of the thermal oxide. The insulating capability of the dielectric layers was evaluated prior to metal filling by using a test kit. The metal filling of the through holes was carried out by bottom-up Cu electroplating and followed by annealing at 300 °C for 1 h to release the electroplating stress and to prevent possible large metal thermal expansion in subsequent high-temperature processes. The TSV arrays with different hole diameters and spacing were detected: no visible defects or structure peeling was found by scanning electron microscopy (SEM) observations, and no detectable interdiffusion between Cu and the dielectric layers was detected by energy dispersive X-ray (EDX) analyses. Electric tests indicated that the leakage currents between two adjacent TSVs were as low as 6.80 × 10−10 A when a DC voltage was ramped up from 0 to 350 V, and 2.86 × 10−9 A after a DC voltage was kept at 100 V for 200 s.

This paper presents AlScN piezoelectric two-axis MEMS mirrors with gimbal-less and gimbaled designs fabricated in a CMOS-compatible manner. Integrated piezoelectric sensors provided feedback signals of the actual mirror positions. The mirror with a diameter of 1.5 mm possessed adjustable optical tilt angles of up to 22.6° @ 30 V, with a high resonance frequency of about 8.2 kHz, while the 3 mm mirror reached 48.5° @ 41 V. The mirror with the gimbaled structure exhibited an excellent field of view and good mechanical decoupling. Additionally, a significant improvement in mirror scanning performance was observed in a vacuum (4 Pa), proving that the optical field of view was magnified by more than a factor of 10.

Accurate and efficient measurements of the piezoelectric properties of AlN and AlScN films are very important for the design and simulation of micro-electro-mechanical system (MEMS) sensors and actuator devices. In this study, a process control monitor (PCM) structure compatible with the device manufacturing process is designed to achieve accurate determination of the piezoelectric coefficients of MEMS devices. Double-beam laser interferometry (DBLI) and laser Doppler vibrometry (LDV) measurements are applied and combined with finite element method (FEM) simulations, and values of the piezoelectric parameters d33 and d31 are simultaneously extracted. The accuracy of d31 is verified directly by using a cantilever structure, and the accuracy of d33 is verified by in situ synchrotron radiation X-ray diffraction; the comparisons confirm the viability of the results obtained by the novel combination of LDV, DBLI and FEM techniques in this study.

This paper presents a simple and reliable routine for batch fabrication of wear-resistant and conductive probe with a PtSi tip. The fabrication process is based on inductively coupled plasma (ICP) etching, metal evaporation, and annealing. Si tips with curvature radii less than 10 nm were produced with good wafer-level uniformity using isotropic etching and thermal oxygen sharpening. The surface roughness of the etched tip post was reduced by optimized isotropic etching. The dependence of the platinum silicide morphology on annealing conditions were also systematically investigated, and conductive and wear-resistant probes with PtSi tips of curvature radii less than 30 nm were batch fabricated and applied for scanning piezoelectric samples.

This work reports a batch fabrication process for silicon nanometer tip based on isotropic inductively coupled plasma (ICP) etching technology. The silicon tips with nanometer apex and small surface roughness are produced at wafer-level with good etching homogeneity and repeatability. An ICP etching routine is developed to make silicon tips with apex radius less than 5 nm, aspect ratio greater than 5 at a tip height of 200 nm, and tip height more than 10 μm, and high fabrication yield is achieved by mask compensation and precisely controlling lateral etch depth, which is significant for large-scale manufacturing.