8 results on '"Lee, Chang-Chun"'
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2. Packaging reliability estimation of high-power device modules by utilizing silver sintering technology
3. Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays
4. Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology
5. Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology
6. Effect of contact-etch-stop-layer and Si 1-x Ge x channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays
7. Light degradation test and design of thermal performance for high-power light-emitting diodes
8. Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
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