1. Fast diffusers in a thermal gradient (solder ball)
- Author
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K.J. Ryan, B.H. Wood, N.A. Connelly, Xiaoli He, and James R. Lloyd
- Subjects
Materials science ,Metallurgy ,Mechanical engineering ,Solder ball ,Condensed Matter Physics ,Atomic and Molecular Physics, and Optics ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Temperature gradient ,Reliability (semiconductor) ,Soldering ,Boundary value problem ,Electrical and Electronic Engineering ,Diffuser (sewage) ,Safety, Risk, Reliability and Quality - Abstract
The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed.
- Published
- 2010
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