19 results on '"Travaly, Y."'
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2. Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
3. Variation in process conditions of porogen-based low- k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route
4. Air gap formation by UV-assisted decomposition of CVD material
5. Materials characterization of WN xC y, WN x and WC x films for advanced barriers
6. Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP
7. A novel approach to resistivity and interconnect modeling
8. Challenges in the implementation of low-k dielectrics in the back-end of line
9. Characterization of atomic layer deposited nanoscale structure on dense dielectric substrates by X-ray reflectivity
10. Study of thermal stability of nickel silicide by X-ray reflectivity
11. Challenges for structural stability of ultra-low- k-based interconnects
12. Impact of material/process interactions on the properties of a porous CVD-O 3 low-k dielectric film
13. Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
14. Preface
15. Materials characterization of WNxCy, WNx and WCx films for advanced barriers
16. Surface properties restoration and passivation of high porosity ultra low-k dielectric (k∼2.3) after direct-CMP
17. Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
18. Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
19. Materials characterization of WN x C y , WN x and WC x films for advanced barriers
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