14 results on '"Kim, Nam-Hoon"'
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2. Electromigration characteristics in dual-damascene copper interconnects by difference of via structures
3. Creation mechanism of metal depression in sputtering process for aluminum interconnects
4. Platinum chemical mechanical polishing (CMP) characteristics for high density ferroelectric memory applications
5. CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters
6. Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process
7. Electrochemical corrosion effects and chemical mechanical polishing characteristics of tungsten film using mixed oxidizers
8. Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions
9. Improvement of TEOS-chemical mechanical polishing performance by control of slurry temperature
10. Effects of conditioning temperature on polishing pad for oxide chemical mechanical polishing process
11. Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions
12. Optimization of nitride films for linear pre-metal dielectric process
13. Chemical mechanical polishing performances by filtering and retreatment of used silica abrasives slurry
14. Erratum to: “Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions” [Microelect. Eng. 83 (2006) 362–370]
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