1. A transgranular fatigue crack growth model based on restricted slip reversibility
- Author
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A. S. Krausz, Xijia Wu, and A. K. Koul
- Subjects
Materials science ,Metallurgy ,Metals and Alloys ,Transgranular fracture ,Fracture mechanics ,Slip (materials science) ,Mechanics ,Paris' law ,Condensed Matter Physics ,Crack growth resistance curve ,Crack closure ,Mechanics of Materials ,mental disorders ,Forensic engineering ,Stress intensity factor ,Stress concentration - Abstract
This article presents a transgranular fatigue crack growth model based on a restricted slip reversal process where the transgranular crack growth rate is related to the cyclic plastic strain range ahead of the crack tip. Upon applying deformation and fracture kinetics theories, a physically based constitutive law for fatigue crack growth rate is derived. In the absence of any environmental contributions to crack growth, the model takes the form of the Paris equation with a power law exponent of 3 at positiveR values. The model expresses the fatigue crack growth rate explicitly in terms of material properties, such as yield strength, work-hardening coefficient, microstructural quantities such as activation energy, activation volume, and work factor, as well as test constraints such asΔK andR. The absence of a fatigue threshold is predicted for test conditions where environment does not influence the crack growth process and the material microstructure remains stable.
- Published
- 1993