1. Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging
- Author
-
Yang Liu, Boqiao Ren, Yuxiong Xue, Min Zhou, Rongxing Cao, and Xianghua Zeng
- Subjects
porous Cu ,solder ,aging ,SnBi ,microstructure evolution ,shear strength ,Materials of engineering and construction. Mechanics of materials ,TA401-492 ,Chemical technology ,TP1-1185 - Abstract
A comparison of the microstructure, interfacial IMC layer, shear behavior and hardness of the Sn58Bi, SnBi@110P-Cu/Cu and SnBi@500P-Cu/Cu solder joints was carried out during isothermal aging in this study. Experimental results reveal that the regions enclosed by Cu frames in SnBi@110P-Cu/Cu exhibit more refined microstructure and higher hardness before and after aging. In contrast, the hardness of the aged SnBi@500P-Cu solder bulk is closer to the SnBi eutectic solder due to their similar microstructure. With the aging time prolonging, β -Sn and Bi-rich phases do not only coarsen in solder joints, but also lead to the rise of the thickness of the interfacial IMC layers. The addition of porous Cu can suppress the formation of voids at the soldering interface and improves the shear strength of the SnBi/Cu solder joints during the aging process. The shear strength of the SnBi@500P-Cu/Cu solder joint is higher than the other two before and after aging.
- Published
- 2021
- Full Text
- View/download PDF