1. Thermal Shock Resistance of Si3N4/hBN Ceramic Composites
- Author
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Csaba Balázsi, Michal Húlan, Ján Dusza, Alexandra Kovalčíková, Mária Mihaliková, Richard Sedlák, and Martin Fides
- Subjects
010302 applied physics ,Thermal shock ,Materials science ,Mechanical Engineering ,Hexagonal boron nitride ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,chemistry.chemical_compound ,Silicon nitride ,chemistry ,Mechanics of Materials ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,General Materials Science ,Ceramic ,Composite material ,0210 nano-technology - Abstract
Si3N4/hBN composites were fabricated by hot isostatic pressing at 1700°C/3h with 1, 3 and 5 wt. % micro-sized or nano-sized hexagonal boron nitride particles added to silicon nitride matrix. An indentation quench test method was used for estimation of thermal shock resistance of monolithic Si3N4and Si3N4/hBN composites. Thermal shock resistance of the composites increased with the increase of size and volume of hBN particles. The critical temperature difference for the composites with micro-sized hBN was significantly higher (over 900°C) compared to the monolithic silicon nitride (580°C).
- Published
- 2018
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