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19. Fabrication and Properties of W-SiCP/Cu Composites by Hot Pressing Sintering

Author

Zhang, Lian Meng, Liu, Yao, Zhang, Cheng Cheng, Luo, Guo Qiang, Liu, Huang, and Shen, Qiang

Abstract

Abstract. A new ternary composite of W-SiCP/Cu(40vol%) was designed and prepared by low-temperature hot-press sintering. The micro-structural characterizations were evaluated by X-ray diffraction (XRD) and scanning electron microstructure (SEM), coefficient of thermal expansion is measured. When sintered at 950°C-100MPa-2h, the relative density of the W-SiCP/Cu composites as a function of W content all exceeded 97%. Due to the plastic deformation of Cu, higher densification W-SiCP/Cu(40vol%) composites can be achieved at a relatively low temperature. The composites are characterized by the relatively low coefficient of thermal expansion, bending strength and hardness. The values of thermal expansion indicate that thermal expansion can be precisely controlled by adding SiC particles.

Published
2016
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20. Preparation and Electrical-Conductive Property of SnO2-Based Ceramics with 0.5% CuO and Sb2O3

Author

Zhang, Lian Meng, Luo, Guo Qiang, Li, J., Zhang, Dong Ming, and Shen, Qiang

Abstract

In this study, SnO2-based ceramics, with 0.5%CuO as sintering aid and Sb2O3 as activator of the electrical conductivity, was obtained by pressureless sintering at 1450°C for 5 h. Densification behavior and microstructure development strongly depend on Sb2O3. The characteristization of microstructures on Sb2O3 concentrations are analyzed by SEM. A small amount of CuO improves densification; Sb2O3 retards the densification of SnO2-based ceramic. The electrical resistivities of SnO2-based ceramics with different contents of Sb2O3 are measured by the standard four probe method and varied in a wide range. The electrical resistivity arrives the minimal value of 4.964×10-2 0·cm for 99%SnO2+0.5%CuO +0.5%Sb2O3. More content of Sb2O3 than that of CuO causes the degression of density and the increasing of electrical resistivity of ceramics.

Published
2007
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