1. Preliminary results from a prototype projection electron-beam stepper-scattering with angular limitation projection electron beam lithography proof-of-concept system
- Author
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M. Mkrtychan, L. C. Hopkins, Harry H. Wade, K. Brady, Steven D. Berger, A. H. Crorken, Myrtle I. Blakey, J. P. Custy, Joseph A. Felker, G. P. Watson, C. Biddick, W. F. Connelly, Reginald C. Farrow, Anthony E. Novembre, Milton L. Peabody, R. M. Camarda, K. S. Werder, R. Dimarco, David Lee Windt, R. G. Tarascon, Chester S. Knurek, H. A. Huggins, R. R. Freeman, J. S. Kraus, Stephen W. Bowler, L. Fetter, James Alexander Liddle, L. R. Harriott, and W. K. Waskiewicz
- Subjects
Physics ,Optics ,Cardinal point ,Resist ,business.industry ,Scattering ,General Engineering ,X-ray lithography ,Stepper ,business ,Projection (set theory) ,Lithography ,Electron-beam lithography - Abstract
We have designed and constructed a proof‐of‐concept projection electron beam lithography system based on the scattering with angular limitation projection electron beam lithography principle. In this system, a thin membrane mask is used in a 4:1 reduction projection system at 100 keV. Image contrast is formed by scattering in the mask and subsequent aperturing of the scattered electrons in the back focal plane of the projection system. We have employed a step‐and‐scan architecture which uses continuously moving mask and wafer stages to trace out the full pattern. The electron beam can thus be kept small (1×1 mm in our case) which greatly simplifies the design of the electron optical system. In addition, the membrane areas can be kept small in linear dimension in one direction, minimizing in‐plane pattern distortions. Our system will be constructed in two stages. In the first stage, the mask stage is static and the wafer stage operates in step‐and‐repeat mode. This initial version of the system allows for ...
- Published
- 1996