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In this study, we investigated the electrical and thermal properties of SiC ceramics with 2 vol% equimolar Y2O3–RE2O3 (RE = Sm, Gd, Lu) additives. The three SiC ceramics with 2 vol% equimolar Y2O3–RE2O3 additives showed electrical conductivities on the order of ~103 (Ω·m)−1, which is one order of magnitude higher than that of the SiC ceramics sintered with 2 vol% Y2O3 only. The increase in electrical conductivity is attributed to the growth of heavily nitrogen-doped SiC grains during sintering and the confinement of oxide additives in the junction area. The thermal conductivities of the SiC ceramics were in the 176–198 W·(m·K)−1 range at room temperature. The new additive systems, equimolar Y2O3–RE2O3, are beneficial for achieving both high electrical conductivity and high thermal conductivity in SiC ceramics.

SiC–TiC0.5N0.5 composites were fabricated from β-SiC and TiN powders with 2 vol% equimolar Y2O3–Sc2O3 additives by conventional hot pressing. Thermal and mechanical properties of the SiC–TiC0.5N0.5 composites were investigated as a function of initial TiN content. Relative densities of ≥98.9% were achieved for all samples. The addition of a small amount of TiN increased thermal conductivity, flexural strength, and fracture toughness of SiC ceramics. However, further addition of TiN in excess of 10 and 20 vol% deteriorated both thermal conductivity and flexural strength of the composites, respectively. In contrast, the fracture toughness of the composites increased continuously from 4.2 to 6.2 MPa∙m1/2 with increasing initial TiN content from 0 to 35 vol%, due to crack deflection by TiC0.5N0.5. The maximum values of thermal conductivity and flexural strength were 224 W/m K for a 2 vol% TiC0.5N0.5 and 599 MPa for a 10 vol% TiC0.5N0.5 composite.