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3. Lateral cracks during sliding indentation on various optical materials.

6. Nanoplastic removal function and the mechanical nature of colloidal silica slurry polishing.

7. Influence of partial charge on the material removal rate during chemical polishing.

11. Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing

13. Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing.

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