1. Fabrication of flexible AlGaInP LED
- Author
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Feng Yajie, Xia Guo, Xiaoying He, Qiaoli Liu, Anqi Hu, and Huijun Tian
- Subjects
Materials science ,Fabrication ,business.industry ,02 engineering and technology ,Substrate (electronics) ,010402 general chemistry ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Led array ,0104 chemical sciences ,Electronic, Optical and Magnetic Materials ,law.invention ,Flexible display ,law ,Materials Chemistry ,Optoelectronics ,Sapphire substrate ,Wafer ,Electrical and Electronic Engineering ,0210 nano-technology ,business ,Light-emitting diode ,Diode - Abstract
Flexible light-emitting diodes (LEDs) are highly desired for wearable devices, flexible displays, robotics, biomedicine, etc. Traditionally, the transfer process of an ultrathin wafer of about 10–30 μm to a flexible substrate is utilized. However, the yield is low, and it is not applicable to thick GaN LED chips with a 100 μm sapphire substrate. In this paper, transferable LED chips utilized the mature LED manufacture technique are developed, which possesses the advantage of high yield. The flexible LED array demonstrates good electrical and optical performance.
- Published
- 2020