1. High-velocity impact performance of sandwich panels with additively manufactured hierarchical honeycomb cores: An experimental and numerical study.
- Author
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Ul Haq, Ahsan and Narala, Suresh Kumar Reddy
- Subjects
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SANDWICH construction (Materials) , *HONEYCOMB structures , *SELECTIVE laser melting , *COREMAKING , *IMPACT testing , *IMPACT (Mechanics) , *LASER peening - Abstract
The honeycomb sandwich panel presents a highly promising solution for enhancing ballistic behavior owing to its excellent strength-to-weight ratio and impact resistance. This study focuses on investigating the shock mitigation properties of honeycomb sandwich panels through experimentation and numerical simulation of high-velocity impact tests. Single-scale and double-scale hierarchical honeycomb cores are manufactured using selective laser melting with AlSi10Mg powder, combined with a pair of stainless steel (SS 316) sheets. High-velocity impact experiments were conducted within a velocity ranging from 100 to 270 m/s to examine the effects of different cores and projectile nose shapes on the dynamic response of the panels. Numerical simulations using ABAQUS/Explicit software were performed and validated against the experimental results. The sandwich panel with a double-scale hierarchical honeycomb core exhibited 7.8% and 6.1% more energy absorption compared to the single-scale hierarchical honeycomb core against conical and hemispherical nose projectiles, respectively. Additionally, the ballistic limit for the hemispherical projectile was found to be 8.9% higher than the conical-nose projectile under the same impact velocity and panel thickness. Moreover, an increase in panel thickness from 12 mm to 25 mm prompted a significant improvement of approximately 39% in specific energy absorption and a 44% increase in ballistic limit velocity. These findings highlight the considerable potential of single-scale and double-scale hierarchical honeycomb sandwich panels for the development of threat-resistant structures in critical dynamic loading applications. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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