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The resonance frequency and the Q-factor of the fundamental and higher order flexural modes of silicon dioxide microcantilevers have been characterized at different pressures and for different thicknesses of gold coating. We present the experimental results and discuss the effect of the gold film on the performance and sensitivity of the cantilevers when used as mass sensors. An almost linear relationship between the Q-factor and the resonance frequency of the uncoated cantilevers is observed, implying that a higher sensitivity can be attained by actuation at higher order resonant modes. We also find that even a thin gold coating may reduce Q-factors by more than an order of magnitude.

The resonance frequency of the fundamental and four higher order modes of a silicon dioxide microcantilever is measured. The effect on these modes of depositing a 400 nm gold coating is investigated theoretically and experimentally. We derive an analytical solution to the eigenmodes of a multi-layered cantilever and verify its validity by comparison to finite-element analysis as well as the experimentally obtained results. The temperature and pressure dependence of the resonance frequencies is investigated experimentally and found to be in good agreement with theoretical models. An experimentally obtained value for the temperature dependence of Young's modulus of elasticity for thermally grown SiO2 is presented.

The ever-increasing complexity of the fabrication process of Point-of-care (POC) devices, due to high demand of functional versatility, compact size and ease-of-use, emphasizes the need of multifunctional materials that can be used to simplify this process. Polymers, currently in use for the fabrication of the often needed microfluidic channels, have limitations in terms of their physicochemical properties. Therefore, the use of a multipurpose biocompatible material with better resistance to the chemical, thermal and electrical environment, along with capability of forming closed channel microfluidics is inevitable. This paper demonstrates a novel technique of fabricating microfluidic devices using polyimide (PI) which fulfills the aforementioned properties criteria. A fabrication process to pattern microfluidic channels, using partially cured PI, has been developed by using a dry etching method. The etching parameters are optimized and compared to those used for fully cured PI. Moreover, the formation of closed microfluidic channel on wafer level by bonding two partially cured PI layers or a partially cured PI to glass with high bond strength has been demonstrated. The reproducibility in uniformity of PI is also compared to the most commonly used SU8 polymer, which is a near UV sensitive epoxy resin. The potential applications of PI processing are POC and biosensor devices integrated with microelectronics.