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We present designs, theory, and results of fabrication and testing for a novel parallel microrobotic assembly scheme using stress-engineered MEMS microrobots. The robots are 240-280 [micro]m x 60 [micro]m x 7-20 [micro]m in size and can be controlled to dock compliantly together, forming planar structures several times this size. The devices are classified into species based on the design of their steering arm actuators, and the species are further classified as independent if they can be maneuvered independently using a single global control signal. In this paper, we show that microrobot species are independent if the two transition voltages of their steering arms, i.e., the voltages at which the arms are raised or lowered, form a unique pair. We present control algorithms that can be applied to groups of independent microrobot species to direct their motion from arbitrary nondeadlock configurations to desired planar microassemblies. We present designs and fabrication for four independent microrobot species, each with a unique transition voltage. The fabricated microrobots are used to demonstrate directed assembly of five types of planar structures from two classes of initial conditions. We demonstrate an average docking accuracy of 5 [micro]m and use self-aligning compliant interaction between the microrobots to further align and stabilize the intermediate assemblies. The final assemblies match their target shapes on average 96 %, by area. Index Terms--Microactuators, microassembly, microelectromechanical systems (MEMS), microrobots, scratch-drive actuators.

We present an untethered, electrostatic, MEMS micro-robot, with dimensions of 60 [micro]m by 250 [micro]m by 10 [micro]m. The device consists of a curved, cantilevered steering arm, mounted on an untethered scratch drive actuator (USDA). These two components are fabricated monolithically from the same sheet of conductive polysilicon, and receive a common power and control signal through a capacitive coupling with an underlying electrical grid. All locations on the grid receive the same power and control signal, so that the devices can be operated without knowledge of their position on the substrate. Individual control of the component actuators provides two distinct motion gaits (forward motion and turning), which together allow full coverage of a planar workspace. These MEMS micro-robots demonstrate turning error of less than 3.7[degrees]/mm during forward motion, turn with radii as small as 176 [micro]m, and achieve speeds of over 200 [micro]m/sec with an average step size as small as 12 nm. They have been shown to operate open-loop for distances exceeding 35 cm without failure, and can be controlled through teleoperation to navigate complex paths. The devices were fabricated through a multiuser surface micromachining process, and were postprocessed to add a patterned layer of tensile chromium, which curls the steering arms upward. After sacrificial release, the devices were transferred with a vacuum microprobe to the electrical grid for testing. This grid consists of a silicon substrate coated with 13-[micro]m microfabricated electrodes, arranged in an interdigitated fashion with 2-[micro]m spaces. The electrodes are insulated by a layer of electron-beam-evaporated zirconium dioxide, so that devices placed on top of the electrodes will experience an electrostatic force in response to an applied voltage. Control waveforms are broadcast to the device through the capacitive power coupling, and are decoded by the electromechanical response of the device body. Hysteresis in the system allows on-board storage of n = 2 bits of state information in response to these electrical signals. The presence of on-board state information within the device itself allows each of the two device subsystems (USDA and steering arm) to be individually addressed and controlled. We describe this communication and control strategy and show necessary and sufficient conditions for voltage-selective actuation of all [2.sup.n] system states, both for our devices (n = 2), and for the more general case (where n is larger.) [1586] Index Terms--Actuator, control, electrostatic, fabrication, locomotion, MEMS, micro-robot, PolyMUMPS, robotics, scrath-drive, steering, untethered.

The ability for a device to locomote freely on a surface requires the ability to deliver power in a way that does not restrain the device's motion. This paper presents a MEMS actuator that operates free of any physically restraining tethers. We show how a capacitive coupling can be used to deliver power to untethered MEMS devices, independently of the position and orientation of those devices. Then, we provide a simple mechanical release process for detaching these MEMS devices from the fabrication substrate once chemical processing is complete. To produce these untethered microactuators in a batch-compatible manner while leveraging existing MEMS infrastructure, we have devised a novel postprocessing sequence for a standard MEMS multiproject wafer process. Through the use of this sequence, we show how to add, post hoc, a layer of dielectric between two previously deposited polysilicon films. We have demonstrated the effectiveness of these techniques through the successful fabrication and operation of untethered scratch drive actuators. Locomotion of these actuators is controlled by frequency modulation, and the devices achieve maximum speeds of over 1.5 mm/s. [1034] Index Terms--Capacitive coupling, microlocomotion, microrobotics, scratch drive actuators, untethered microactuators.

The first micromachined bimorph organic ciliary array with on-chip CMOS circuitry is presented. This ciliary array is composed of an 8 x 8 array of cells each having four orthogonally oriented actuators in an overall die size of 9.4 x 9.4 mm. The polyimide-based actuators were fabricated directly above the selection and drive circuitry. Selection and activation of actuators in this array shows that integration was successful. The array was programmed to do simple linear and diagonal translations and squeeze-, centering-, and rotating-field manipulations. All three tasks were demonstrated using silicon pieces of various shapes and either 0.55 mm or 0.10 mm thick. [365] Index Terms--Actuator, array, CMOS, integration, micromanipulation, polyimide.