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Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long time Vickers indentation testing at room temperature. Based on the steady-state power law creep relationship, the stress exponents were determined for the cast and wrought materials in the homogenized and unhomogenized conditions. The stress exponent values of 4.5 and 12, depending on the processing route of the material, are in good agreement with those reported for the same material in conventional creep testing at room temperature. The results are discussed on the basis of the microstructural features developed during different processing routes of the material. [ABSTRACT FROM AUTHOR]

The article focuses on effect of annealing temperature on tensile behavior of 5052 Al alloy deformed at cryogenic temperature. Recently, deformation at cryogenic temperature has attracted much attention as one of the effective processes to produce ultrafine grained materials. The suppression of dynamic recovery during deformation at extremely low temperatures is expected to preserve a high density of defects generated by deformation, which can act as the potent recrystallization sites. Accordingly, the cryogenic deformation would require less plastic deformation for achieving ultrafine grains, compared to the severe plastic deformation processes at ambient or elevated temperatures.