37 results on '"Kamyshny A"'
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2. Tuning size distribution of zinc borosilicate glass additives by the length of gallate molecular chain during ball milling for lowering the sintering temperature of copper paste
3. Electrical and mechanical performance of Inkjet-printed flexible electrodes based on reduced graphene oxide/silver nanoparticles
4. Growth and property evaluation of nickel–graphite core–shell nanoparticles based on temperature parameters for utilization in silver paste
5. Silver nanoparticulate antenna tracks sintered under carboxylic acid vapors for flexible radio-frequency identification tag application
6. Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste
7. Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach
8. In3+-doped CuS thin films: physicochemical characteristics and photocatalytic property
9. Low-temperature calcination of convenient micro-sized copper ink with surface activation and synchronous protection by in-situ chemisorbed cupric formate
10. Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device
11. Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors
12. Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature
13. Facile synthesis of silver malonate conductive MOD ink for screen printing
14. Chemical sintering of Ag nanoparticle conductive inks at room temperature for printable electronics
15. Electrochemical corrosion and protection of low-temperature sintered silver nanoparticle paste in NH4Cl solution
16. Processing optimization of SiO2-capped aluminum-doped ZnO thin films for transparent heater and near-infrared reflecting applications
17. Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications
18. Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles
19. Performance of inkjet-printed strain sensor based on graphene/silver nanoparticles hybrid conductive inks on polyvinyl alcohol substrate
20. The conductive properties of ink coating based on Ni–Ag core–shell nanoparticles with the bimodal size distribution
21. High-performance copper mesh for optically transparent electromagnetic interference shielding
22. Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film
23. Corrosion effects on sintered nano-silver joints and the secondary biological hazards
24. Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste
25. Humic acid assisted chemical synthesis of silver nanoparticles for inkjet printing of flexible circuits
26. Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes
27. Fast and low-temperature sintering of Ag paste due to nanoparticles formed in situ
28. Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer
29. Rapid low temperature sintering in air of copper submicron particles with synergistic surface-activation and anti-oxidative protection
30. One step preparation of copper–silver self-catalyzed hybrid conductive ink with reduced sintering temperature for flexible electronics
31. Characterization of the die-attach process via low-temperature reduction of Cu formate in air
32. Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications
33. Inkjet printed flexible electronics on paper substrate with reduced graphene oxide/carbon black ink
34. RF characteristics of flexible circuits patterned with hybrid Ag paste
35. Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics
36. An organic silver complex conductive ink using both decomposition and self-reduction mechanisms in film formation
37. Synthesis of highly environmental stable copper–silver core–shell nanoparticles for direct writing flexible electronics
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