Search

With good composition control in both p-type cap and n-type base LPE layers, it is possible to make barrier-free two-layer P-on-n HgCdTe heterojunction photodiodes with very long cutoff wavelengths. Diode arrays with good RoA operability, good quantum efficiency, and low 1/f noise at 60K have been demonstrated at cutoff wavelengths to 16.3µm. The diode performance continues to improve at lower temperatures, following a diffusion-current trend to at least 35K. Measured RoA values of 2×105 ohm-cm2 for an 18 µm cutoff at 35K are the highest reported at this very long wavelength. A simple defect model applied to the area dependence of RoA at 40K implied a defect areal density of 3×104 cm−2 and a defect impedance of 3×106 ohm.

Variable-area diodes are routinely used to separate surface from bulk effects in the characterization of HgCdTe photodiodes. In this work, the traditional models are reviewed and clarified by comparison to the results of numerical models of diffusion and other effects. It is shown that the characteristic lengths associated with lateral collection of both thermal and photo-generated carriers are not necessarily equal to each other and also are not equal to the minority carrier diffusion length. The effective surface recombination velocity in the traditional model for surface generation-recombination current is shown to have an alternative explanation as the effect of a surface inversion channel. Finally, the relation of the traditional models to the effects of point defects is examined. The average effects of defects with bulk or surface distributions are shown to contribute either zero or positive slope, respectively, in a plot of the inverse of the zero-bias resistance-area product vs the perimeter to area ratio. A negative slope arises from defects whose conductance increases faster than linearly with the diode radius. Distributions of diode dynamic resistance data from over 100 HgCdTe test arrays were analyzed to determine how the probability of a diode being defective varies with diode size. Plots of the diode conductance data ordered by increasing conductance indicate that the onset of defects occurs for a percentage of diodes of a given size which increases approximately linearly with the diode perimeter. This suggests that these defects have a perimeter rather than bulk origin.

We report the implementation of recent advances in metalorganic chemical vapor deposition (MOCVD) for in situ growth of four-layer HgCdTe mid wave/ long wave (MW/LW) simultaneous dual-band 64 × 64 infrared detector arrays. This independently accessed, simultaneous, double-heterojunction p-n-N-P dualband detector has two back-to-back stacked photodiodes grown on CdZnTe (100) substrates. The LW photodiode is a p-on-n heterojunction grown on top of an MW N-on-P heterojunction photodiode. Secondary ion mass spectrometry depth profiles of these 28 µ m thick p-n-N-P dual-band films show four well-defined regions of alloy composition and doping, and agree well with the device design. 64 × 64 arrays of dual-band detectors were fabricated from these films using electron cyclotron resonance dry etching and CdTe passivation, and hybridized to a dual-band readout chip. Two bump inter-connects in each unit cell provide independent electrical access to the back-to-back MW and LW photodiodes, and allow the MW and LW photocurrents to be separate and independent. The dualband infrared focal plane arrays (IRFPAs) spectral response data at 78K are well-behaved and are fully consistent with that observed in individual singleband LW p-on-n and MW N-on-P heterojunction devices of the same design. The hybridized 64 × 64 duai-band FPAs have MW and LW average in-band quantum efficiencies of 79 and 67%, and median D* values of 4.8 × 1011 and 7.1 × 1010 cm-√Hz/W, in the respective spectral bands at 78K. The data demonstrate that MOCVD has progressed significantly toward being a practical and viable vapor phase in situ growth technology for advanced bandgap-engineered HgCdTe detector arrays.

A new analytical model for the bias-dependent quantum efficiency of a HgCdTe P-on-n heterojunction photodiode with a valence band barrier elucidates the important physics of the phenomenon and shows that the background-induced shunt resistance is a result of the same mechanism, that is, a tendency of the light-induced carriers to pile up in the base layer due to the retarding field produced by the barrier. A parameterized version of the model agrees well with experimental current-vs-voltage and noise measurements.

We report new results on metalorganic chemical vapor deposition (MOCVD)in situ growth of long wavelength infrared (LWIR) P-on-n and medium wavelength infrared (MWIR) n-on-P HgCdTe heterojunction photodiodes using the interdiffused multilayer process (IMP). The n-type regions are doped with iodine using the precursor ethyl iodide (El). I-doped HgCdTe using El has mobilities higher than that obtained on undoped background annealed films and are comparable to LPE grown In-doped HgCdTe. The p-type layers are doped with arsenic from either tertiarybutylarsine (TBAs) or a new precursor,tris-dimethylaminoarsenic (DMAAs). The substrates used in this work are lattice matched CdZnTe oriented (211)B or (100)4°→«110». Junction quality was assessed by fabricating and characterizing backside-illuminated arrays of variable-area circular mesa photodiodes. This paper presents four new results. First, carrier lifetimes measured at 80K on arsenic doped single HgCdTe layers are generally longer for films doped from the new precursor DMAAs than from TBAs. Second, we present data on the first P-on-n HgCdTe photodiodes grownin situ with DMAAs which have R0A products limited by g-r current at 80K for λco = 7–12 μm, comparable to the best R0A products we have achieved with TBAs. Third, we report the first experimental data on a new HgCdTe device architecture, the n-on-P heterojunction, with a wide gap p-type layer which allows radiation incident through the substrate to be absorbed in a narrower gap n-type layer, thereby eliminating interface recombination effects. With the n-on-P architecture, MWIR photodiodes were obtained reproducibly with classical spectral response shapes, high quantum efficiencies (70-75%) and R0A products above 2 x 105 ohm-cm2 for λco = 5.0 μm at 80K. Fourth, we report 40K data for LWIR P-on-n HgCdTe heterojunction photodiodes (using TBAs), with R0A values of 2 x 104 ohm-cm2 for λco = 11.7 μm and 5 x 105 ohm-cm2 for λco - 9.4 μm. These are the highest R0A values reported to date for LWIR P-on-n heterojunctions grownin situ by MOCVD.

Metalorganic chemical vapor depositon (MOCVD) in situ growth of p-on-n junctions for long wavelength infrared (LWIR) and medium wavelength infrared (MWIR) photodiodes is reported. The interdiffused multilayer process was used for the growth of the HgCdTe junctions on CdTe and CdZnTe substrates. The n-type region was grown undoped while the p-type layer was arsenic doped using tertiarybutylarsine. Following a low temperature anneal in Hg vapor, carrier densities of (0.2-2) x 1015 cm3 and mobilities of (0.7-1.2) x 105 cm2/V-s were obtained for n-type LWIR (x ~ 0.22) layers at 80K. Carrier lifetimes of these layers at 80 K are ~l-2 μs. For the p-type region arsenic doping was controlled in the range of (1-20) x 1016 cm-3. Arsenic doping levels in the junctions were determined by calibrated secondary ion mass spectroscopy depth profile measurements. Composition and doping of the p-on-n heterojunctions could be independently controlled so that the electrical junction could be located deeper than the change in the composition. The graded composition region between the narrow and wide (x = 0.28-0.30) bandgap regions are 1–2 μm depending on the growth temperature. Backside-illuminated variable-area circular mesa photodiode arrays were fabricated on the grown junctions as well as on ion implanted n-on-p MWIR junctions. The spectral responses are classical in shape. Quantum efficiencies at 80K are 42–77% for devices without anti-reflection coating and with cutoff wavelengths of 4.8–11.0 μm. Quantum efficiencies are independent of reverse bias voltage and do not decrease strongly at lower temperatures indicating that valence band barrier effects are not present. 80K RoA of 15.9 Ω-cm2 was obtained for an array with 11.0 μm cutoff. Detailed measurements of the characteristics of the MOCVD in situ grown and implanted photodiodes are reported.

We report arsenic doping of Hg1-xCdxTe (0.2 < x < 0.3) grown using metalorganic vapor phase epitaxy (MOVPE) by the direct alloy growth (DAG) technique. Tertiarybutylarsine (TBAs) was used as a precursor for As doping. Several epilayers were grown at different Hg partial pressures and TBAs bubbler temperatures in order to study the doping characteristics. The amount of As incorporated in the layer as well as the acceptor concentration were found to be a strong function of the Hg pressure. Secondary ion mass spectrometric studies on heterostructures showed that the compositional interdiffusion is less than the diffusion of As during growth. P-N junctions were grown using TBAs for the first time and several of these layers were processed to fabricate photodiodes. A p-on-n grown junction photodiode with a cutoff wavelength of 8.2 μm had an RoA value of 241 ohm-cm2 at 80K and is the highest reported value for p-on-n DAG-MOVPE devices. Methods to improve the device RoA of the grown junctions are also proposed.

We report the first data for a new two-color HgCdTe infrared detector for use in large dual-band infrared focal plane arrays (IRFPAs). Referred to as the independently accessed back-to-back photodiode structure, this novel dual-band HgCdTe detector provides independent electrical access to each of two spatially collocated back-to-back HgCdTe photodiodes so that true simultaneous and independent detection of medium wavelength (MW, 3–5 μm) and long wavelength (LW, 8–12 μm) infrared radiation can be accomplished. This new dual-band detector is directly compatible with standard backside-illuminated bump-interconnected hybrid HgCdTe IRFPA technology. It is capable of high fill factor, and allows high quantum efficiency and BLIP sensitivity to be realized in both the MW and LW photodiodes. We report data that demonstrate experimentally the key features of this new dual-band detector. These arrays have a unit cell size of 100 x 100 μm2, and were fabricated from a four-layer p-n-N-P HgCdTe film grown in situ by metalorganic chemical vapor deposition on a CdZnTe substrate. At 80K, the MW detector cutoff wavelength is 4.5 μm and the LW detector cutoff wavelength is 8.0 μm. Spectral crosstalk is less than 3%. Data confirm that the MW and LW photodiodes are electrically and radiometrically independent.