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A novel polytriazole resin prepared from p-xylylene diazide (XDA) and N,N,N′,N′-tetrapropargyl-p,p′-diaminodiphenylmethane (TPDDM) was synthesized and characterized. The resin is soluble in common solvents like acetone. The results show that the polytriazole resin can be cured at 70°C. The glass transition temperature and thermal decomposition temperature of the cured resin are 218 and 350°C, respectively. The tensile and flexural strengths of the cured resin achieve 99.0 and 200 MPa, respectively. It is potential as a low cost and easy processing thermal resistant polymer matrix for advanced composite applications. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1038–1042, 2007

Several new bisbenzocyclobutene-terminated aromatic imides, 2,2′-bis(N-4-benzocyclobutenyl) phthalimide, 2,2′-bis[4-(N-4-benzocyclobutenylphthalimide)]-ether, 2,2′-bis[4-(N-4-benzocyclobutenylphthalimide)]-ketone, and 2,2′-bis[4-(N-4-benzo cyclobutenylphthalimid-4-oxy) phenyl]-propane, have been synthesized in high yields and characterized by FTIR, MS, EA, and 1H NMR spectroscopy. The polymers cured from benzocyclobutene-terminated imides have high glass transition temperature and good thermal stabilities. The cure reaction of an imide was studied by FTIR-ATR (attenuated total reflection) and DSC techniques. Apparent kinetic parameters of the cure reaction are obtained. The apparent cure reaction order, activation energy, and pre-exponential factor determined by isothermal DSC method are 1, 143.4 kJ/mol, and 3.88× 1013 min−1, and by nonisothermal DSC methods 1, 139.4 kJ/mol, and 2.27× 1013 min−1, respectively. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1705–1719, 2006