Search

Titanium dioxide (TiO2) is a high-performance material for emerging device applications, such as in resistive switching memories, in high-k capacitors, or, due to its flexoelectricity, in micro/nano-electro-mechanical systems. Enhanced electrical properties of TiO2 are ensured, especially by a careful selection of the bottom electrode material. Iridium dioxide (IrO2) is an excellent choice, as it favors the high-k rutile phase growth of TiO2. In this study, we introduce the fabrication of IrO2/TiO2/IrO2 capacitors and thoroughly characterize their electrical behavior. These capacitors show a dielectric constant for low temperature sputtered TiO2 of ∼70. From leakage current measurements, a coupled capacitive–memristive behavior is determined, which is assumed due to the presence of a reduced TiO2−x layer at the IrO2/TiO2 interface observed from transmission electron microscopy analyses. The memristive effect most probably originates from trapping and detrapping of electric charges in oxygen vacancy defects, which themselves can be generated and annihilated through an applied electric field, subsequently changing the resistance of the capacitor. The electric degradation type is identified as a filament-forming mechanism. Additionally, the temperature dependence of the leakage current is measured, demonstrating that the temperature behavior is strongly influenced by the ambient atmosphere. The latter dependency leads to the hypothesis that the oxygen evolution reaction of water incorporated in the IrO2/TiO2 interface passivates vacancies, thus significantly impacting the vacancy density in TiO2 and, as a further consequence, the electrical performance. [ABSTRACT FROM AUTHOR]

The impact of thermal post deposition annealing in oxygen at different temperatures on the Ge/Y2O3 interface is investigated using metal oxide semiconductor capacitors, where the yttrium oxide was grown by atomic layer deposition from tris(methylcyclopentadienyl)yttrium and H2O precursors on n-type (100)-Ge substrates. By performing in-situ X-ray photoelectron spectroscopy, the growth of GeO during the first cycles of ALD was proven and interface trap densities just below 1 × 1011 eV-1cm-2 were achieved by oxygen annealing at high temperatures (550 °C-600 °C). The good interface quality is most likely driven by the growth of interfacial GeO2 and thermally stabilizing yttrium germanate. [ABSTRACT FROM AUTHOR]

The piezoelectric properties of wurtzite aluminium nitride (w-AlN) are enhanced by alloying with scandium (Sc), thus offering superior properties for applications in micro electro-mechanical systems devices. ScxAl1-xN thin films have been prepared by DC reactive magnetron sputtering on Si (100) substrates from a single target. When targeting a concentration range from x=0 up to x=0.15, the preparation conditions have been optimized by varying the Ar/N2 ratio in the sputtering gas. To incorporate an increasing Sc concentration, a higher Ar/N2 ratio has to be applied during the deposition process. Hence, the argon concentration in the sputtering gas becomes a crucial parameter for microstructure-related parameters. To determine phase purity, degree of c-axis orientation, lattice parameter, and grain size, the ScxAl1-xN thin films were investigated by techniques, such as scanning electron microscopy, transmission electron microscopy, and X-ray diffraction. [ABSTRACT FROM AUTHOR]

According to theory, x-ray magnetic circular dichroism in a synchrotron is equivalent to energy loss magnetic chiral dichroism (EMCD) in a transmission electron microscope (TEM). After a synopsis of the development of EMCD, the theoretical background is reviewed and recent results are presented, focusing on the study of magnetic nanoparticles for ferrofluids and Heusler alloys for spintronic devices. Simulated maps of the dichroic strength as a function of atom position in the crystal allow evaluating the influence of specimen thickness and sample tilt on the experimental EMCD signal. Finally, the possibility of direct observation of chiral electronic transitions with atomic resolution in a TEM is discussed. [ABSTRACT FROM AUTHOR]