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The F control of the point defect density in preamorphized Si layers is studied by investigating the F incorporation process during the solid phase epitaxy (SPE) of amorphous Si layers. The results have demonstrated F to be a versatile and powerful tool to control the point defect density in Si, acting as a trap for the Is and indirectly modifying the diffusivity of dopants.

Determination of the optical bandgap (Eg) in semiconductor nanostructures is a key issue in understanding the extent of quantum confinement effects (QCE) on electronic properties and it usually involves some analytical approximation in experimental data reduction and modeling of the light absorption processes. Here, we compare some of the analytical procedures frequently used to evaluate the optical bandgap from reflectance (R) and transmittance (T) spectra. Ge quantum wells and quantum dots embedded in SiO2 were produced by plasma enhanced chemical vapor deposition, and light absorption was characterized by UV-Vis/NIR spectrophotometry. R&T elaboration to extract the absorption spectra was conducted by two approximated methods (single or double pass approximation, single pass analysis, and double pass analysis, respectively) followed by Eg evaluation through linear fit of Tauc or Cody plots. Direct fitting of R&T spectra through a Tauc-Lorentz oscillator model is used as comparison. Methods and data are discussed also in terms of the light absorption process in the presence of QCE. The reported data show that, despite the approximation, the DPA approach joined with Tauc plot gives reliable results, with clear advantages in terms of computational efforts and understanding of QCE. [ABSTRACT FROM AUTHOR]

A scanning capacitance microscopy (SCM) was carried out in the angle beveling configuration on B doped, very narrow quantum wells (QWs) of Si0.75Ge0.25 layers strained between Si films. The results showed that a spatial SCM resolution of at least 5 nm was demonstrated on angle beveled samples, not only in terms of signal sensitivity, but also in terms of quantitative majority carrier profiling.

O:Er concentration effects on structural, electrical and optical properties of Si:Er:O layers are examined.

The role of the interface potential on the effective mass of charge carriers is elucidated in this work. We develop a new theoretical formalism using a spatially dependent effective mass that is related to the magnitude of the interface potential. Using this formalism, we studied Ge quantum dots (QDs) formed by plasma enhanced chemical vapour deposition (PECVD) and co-sputtering (sputter). These samples allowed us to isolate important consequences arising from differences in the interface potential. We found that for a higher interface potential, as in the case of PECVD QDs, there is a larger reduction in the effective mass, which increases the confinement energy with respect to the sputter sample. We further understood the action of O interface states by comparing our results with Ge QDs grown by molecular beam epitaxy. It is found that the O states can suppress the influence of the interface potential. From our theoretical formalism, we determine the length scale over which the interface potential influences the effective mass. [ABSTRACT FROM AUTHOR]

Germanium quantum dots (QDs) embedded in SiO2 or in Si3N4 have been studied for light harvesting purposes. SiGeO or SiGeN thin films, produced by plasma enhanced chemical vapor deposition, have been annealed up to 850 °C to induce Ge QD precipitation in Si based matrices. By varying the Ge content, the QD diameter can be tuned in the 3-9 nm range in the SiO2 matrix, or in the 1-2 nm range in the Si3N4 matrix, as measured by transmission electron microscopy. Thus, Si3N4 matrix hosts Ge QDs at higher density and more closely spaced than SiO2 matrix. Raman spectroscopy revealed a higher threshold for amorphous-to-crystalline transition for Ge QDs embedded in Si3N4 matrix in comparison with those in the SiO2 host. Light absorption by Ge QDs is shown to be more effective in Si3N4 matrix, due to the optical bandgap (0.9-1.6 eV) being lower than in SiO2 matrix (1.2-2.2 eV). Significant photoresponse with a large measured internal quantum efficiency has been observed for Ge QDs in Si3N4 matrix when they are used as a sensitive layer in a photodetector device. These data will be presented and discussed, opening new routes for application of Ge QDs in light harvesting devices. [ABSTRACT FROM AUTHOR]

Superlattices of Si3N4 and Si-rich silicon nitride thin layers with varying thickness were prepared by plasma enhanced chemical vapor deposition. After high temperature annealing, Si nanocrystals were formed in the former Si-rich nitride layers. The control of the Si quantum dots size via the SiNx layer thickness was confirmed by transmission electron microscopy. The size of the nanocrystals was well in agreement with the former thickness of the respective Si-rich silicon nitride layers. In addition X-ray diffraction evidenced that the Si quantum dots are crystalline whereas the Si3N4 matrix remains amorphous even after annealing at 1200 °C. Despite the proven Si nanocrystals formation with controlled sizes, the photoluminescence was 2 orders of magnitude weaker than for Si nanocrystals in SiO2 matrix. Also, a systematic peak shift was not found. The SiNx/Si3N4 superlattices showed photoluminescence peak positions in the range of 540-660 nm (2.3-1.9 eV), thus quite similar to the bulk Si3N4 film having peak position at 577 nm (2.15 eV). These rather weak shifts and scattering around the position observed for stoichiometric Si3N4 are not in agreement with quantum confinement theory. Therefore theoretical calculations coupled with the experimental results of different barrier thicknesses were performed. As a result the commonly observed photoluminescence red shift, which was previously often attributed to quantum-confinement effect for silicon nanocrystals, was well described by the interference effect of Si3N4 surrounding matrix luminescence. [ABSTRACT FROM AUTHOR]

Thin film Si:O alloys have been grown by plasma enhanced chemical vapor deposition, as intrinsic or highly doped (1 to 5 at. % of B or P dopant) layers. UV-visible/near-infrared spectroscopy revealed a great dependence of the absorption coefficient and of the optical gap (Eg) on the dopant type and concentration, as Eg decreases from 2.1 to 1.9 eV, for the intrinsic or highly p-doped sample, respectively. Thermal annealing up to 400 °C induces a huge H out-diffusion which causes a dramatic absorption increase and a reduction of Eg, down to less than 1.8 eV. A prototypal solar cell has been fabricated using a 400 nm thick, p-i-n structure made of Si:O alloy embedded within flat transparent conductive oxides. Preliminary electrical analyses show a photovoltaic (PV) effect with an open circuit voltage of 0.75 V and a spectral conversion efficiency blue-shifted in comparison to a-Si:H based cell, as expected since the higher Eg in Si:O alloy. These data are presented and discussed, suggesting Si:O alloy as promising material for PV device fabrication. [ABSTRACT FROM AUTHOR]

We report a systematic study of time-resolved and power-dependent photoresponse in high-efficiency germanium quantum dot photodetectors (Ge-QD PDs), with internal quantum efficiencies greater than 100% over a broad wavelength, reverse bias, and incident power range. Turn-on and turn-off response times (τon and τoff) are shown to depend on series resistance, bias, optical power, and thickness (WQD) of the Ge-QD layer, with measured τoff values down to ∼40 ns. Two different photoconduction regimes are observed at low and high reverse bias, with a transition around -3 V. A transient current overshoot phenomenon is also observed, which depends on bias and illumination power. [ABSTRACT FROM AUTHOR]

This paper investigates the morphological evolution of hydrogenated amorphous silicon layers obtained by plasma enhanced chemical vapor deposition at different H dilutions in the regime close to the formation of the nanocrystalline phase. The role of hydrogen in the transition from the amorphous to the crystalline phase is investigated by accurate structural and chemical characterization, from the early stages of nucleation, where the nuclei present size slightly larger than the critical nucleus, i.e., about 0.8 nm in radius, up to the formation of crystalline grains larger than 30 nm in radius. A correlation between the structural characteristics of such crystalline phase and the bonding mechanism of Si with H through multiple hydrides, such as Si-H2 and Si-H3 is found, particularly the tri-hydrides are found to be directly correlated to the shape and the size of the nanocrystallites present in the films. The multiple hydrides are found to play a role also in the electrical characteristics of p-i-n a-Si:H solar cells whose intrinsic layer is realized in the above H dilution conditions. An explanation of the experimental data in terms of the different bonding mechanism of H in the Si matrix is provided. [ABSTRACT FROM AUTHOR]

We present an extended model for B clustering in crystalline or in preamorphized Si and with validity under conditions below and above the equilibrium solid solubility limit of B in Si. This model includes boron-interstitial clusters (BICs) with BnIm configurations-complexes with n B atoms and m Si interstitials-larger (n > 4), and eventually more stable, than those included in previous models. In crystalline Si, the formation and dissolution pathways into large BICs configurations require high B concentration and depend on the flux of Si interstitials. In the presence of high Si interstitial flux, large BICs with a relatively large number of interstitials (m ≥ n) are formed, dissolving under relatively low thermal budgets. On the contrary, for low Si interstitial flux large BICs with few interstitials (m < n) can form, which are more stable than small BICs, and whose complete dissolution requires very intense thermal budgets. We have also investigated the kinetics of large BICs in preamorphized Si, both experimentally and theoretically. B was implanted at a high-dose into preamorphized Si, and the B precipitation was studied by transmission electron microscopy and by sheet resistance and Hall measurement techniques. A simplified model for B clustering and redistribution in amorphous Si is proposed, including the experimental value for the B diffusivity in amorphous Si and the energetics of BICs. Our model suggests that B2, B3I, B4I and B4I2 clusters are the most energetically favored configurations, with relative abundance depending on B concentration. After recrystallization, thermal anneals up to 1100 °C evidence that BICs evolve under very low flux of Si interstitials under the particular experimental conditions considered. Simulations indicate that for very high B concentrations and low Si interstitial flux a significant fraction of the initial small BICs evolves into larger and very stable BIC configurations that survive even after intense thermal budgets, as confirmed by energy filtered transmission electron microscopy analyses. The correlation between simulations and Hall measurements on these samples suggest that hole mobility is significantly degraded by the presence of a high concentration of BICs. [ABSTRACT FROM AUTHOR]

Resistivity transients of tin oxide films at step isothermal changes in oxygen pressure are investigated. It is expected that, after exposing the samples to oxygen, the resistivity would increase monotonically as barriers become higher to finally reach a plateau at steady state. Here we present experimental results showing a nonmonotonic resistivity transient response that cannot be explained by only considering changes in the Schottky barrier heights. We provide an explanation based on the effects of intragrain oxygen diffusion that accounts for the observed main features of conduction in this polycrystalline material. Oxygen diffuses into the grains annihilating vacancies; the donor concentration is then reduced affecting the sample conductivity. [ABSTRACT FROM AUTHOR]

Thin films (100-500 nm) of the Si:O alloy have been systematically characterized in the optical absorption and electrical transport behavior, by varying the Si content from 43 up to 100 at. %. Magnetron sputtering or plasma enhanced chemical vapor deposition have been used for the Si:O alloy deposition, followed by annealing up to 1250 °C. Boron implantation (30 keV, 3-30×1014 B/cm2) on selected samples was performed to vary the electrical sheet resistance measured by the four-point collinear probe method. Transmittance and reflectance spectra have been extracted and combined to estimate the absorption spectra and the optical band gap, by means of the Tauc analysis. Raman spectroscopy was also employed to follow the amorphous-crystalline (a-c) transition of the Si domains contained in the Si:O films. The optical absorption and the electrical transport of Si:O films can be continuously and independently modulated by acting on different parameters. The light absorption increases (by one decade) with the Si content in the 43-100 at. % range, determining an optical band gap which can be continuously modulated into the 2.6-1.6 eV range, respectively. The a-c phase transition in Si:O films, causing a significant reduction in the absorption coefficient, occurs at increasing temperatures (from 600 to 1100 °C) as the Si content decreases. The electrical resistivity of Si:O films can be varied among five decades, being essentially dominated by the number of Si grains and by the doping. Si:O alloys with Si content in the 60-90 at. % range (named oxygen rich silicon films), are proved to join an appealing optical gap with a viable conductivity, being a good candidate for increasing the conversion efficiency of thin-film photovoltaic cell. [ABSTRACT FROM AUTHOR]

The photon absorption in Si quantum dots (QDs) embedded in SiO2 has been systematically investigated by varying several parameters of the QD synthesis. Plasma-enhanced chemical vapor deposition (PECVD) or magnetron cosputtering (MS) have been used to deposit, upon quartz substrates, single layer, or multilayer structures of Si-rich-SiO2 (SRO) with different Si content (43–46 at. %). SRO samples have been annealed for 1 h in the 450–1250 °C range and characterized by optical absorption measurements, photoluminescence analysis, Rutherford backscattering spectrometry and x-ray Photoelectron Spectroscopy. After annealing up to 900 °C SRO films grown by MS show a higher absorption coefficient and a lower optical bandgap (∼2.0 eV) in comparison with that of PECVD samples, due to the lower density of Si–Si bonds and to the presence of nitrogen in PECVD materials. By increasing the Si content a reduction in the optical bandgap has been recorded, pointing out the role of Si–Si bonds density in the absorption process in small amorphous Si QDs. Both the photon absorption probability and energy threshold in amorphous Si QDs are higher than in bulk amorphous Si, evidencing a quantum confinement effect. For temperatures higher than 900 °C both the materials show an increase in the optical bandgap due to the amorphous-crystalline transition of the Si QDs. Fixed the SRO stoichiometry, no difference in the optical bandgap trend of multilayer or single layer structures is evidenced. These data can be profitably used to better implement Si QDs for future PV technologies. [ABSTRACT FROM AUTHOR]

The electrical activation and clustering of Ga implanted in crystalline Ge was investigated in the (0.3–1.2)×1021 Ga/cm3 concentration range. To this aim, Ge samples implanted with 50 keV gallium, and annealed at several temperatures up to 650 °C, have been subjected to a detailed structural and electrical characterization. The substrate was maintained at 77 K during implantation to avoid the formation of the honeycomb structure that occurs during implantation at room temperature of heavy ions at high fluence. Secondary ion mass spectrometry analyses indicated a negligible Ga diffusion and dopant loss during the thermal annealing. The carrier concentration in the recrystallized samples measured by Hall effect showed a maximum concentration of active Ga of ∼6.6×1020 Ga/cm3. A remarkable Ga deactivation occurred with increasing the annealing temperature from 450 to 650 °C although the sheet resistance did not change considerably in this temperature range. It turned out that the carrier concentration reduction is balanced by the enhancement of the hole mobility that exhibits a steep variation with the concentration of the ionized scattering centers in this range. A simple model is proposed to explain the experimental results taking into account the thermally activated Ga clustering. These studies, besides clarifying the mechanism of Ga deactivation in Ge, can be helpful for the realization of future generation devices based on Ge. [ABSTRACT FROM AUTHOR]

Experimental studies about electrical activation and clustering of B implanted in crystalline Ge (c-Ge) are reported. To this aim, we structurally and electrically investigated c-Ge samples implanted at different temperatures with B at 35 keV in the high-concentration dopant regime (0.67–25×1020 B/cm3). We elucidated that a high level of damage, in the form of amorphous pockets, favors the electrical activation of the dopant, and a complete activation was achieved for properly chosen implant conditions. We found, by joining channeling measurements with the electrical ones, that the reason for incomplete B activation is the formation of B-Ge complexes with a well-defined stoichiometry of 1:8. The thermal stability of the B-doped samples, up to 550 °C, was also investigated. The tested stability demonstrates that the B clustering, responsible of B inactivity, is characterized by high binding energies and higher thermal budgets are needed to make them to dissolve. These studies, besides clarify the physical mechanisms by which B dopes Ge, can be helpful for the realization of ultrashallow junctions for the future generation devices. [ABSTRACT FROM AUTHOR]

The formation and growth of nanovoids in a C-doped Si layer after He+ implantation and thermal annealing are reported. A structure consisting of 240 nm of Si, 20 nm of Si doped with C at 0.8 at. %, and 240 nm of Si cap was realized by molecular beam epitaxy onto a (100) Si Czochralsky substrate. Three sets of samples were implanted with He+ at 30 keV and different doses of 8×1015, 3×1016, and 5×1016 cm-2 and subsequently annealed at 800 °C in N2 atmosphere. Cross-section transmission electron microscopy was used to determine the void size and location. The tensile strain of the C-doped layer was measured by high-resolution x-ray diffraction. Our studies report the double role of C in the formation and evolution of nanovoids. After the low dose implantation, the C-doped layer still shows tensile strain due to substitutional C, and voids are localized only within this layer. At higher implantation doses, all the C atoms have been displaced from substitutional sites. No more strain is present in the C-doped layer and the presence of large cavities in its neighborhood is strongly inhibited. This work shows how localized strain in epitaxial films can be effectively used to drive nanovoid formation and evolution. [ABSTRACT FROM AUTHOR]

Metastable pseudomorphic Si0.83Ge0.17 with thickness of 135 nm was deposited on (001) Si substrate by molecular beam epitaxy and amorphized to a depth of ∼360 nm, using 3×1015 cm-2 Ge ions at 270 keV. Samples were regrown by solid phase epitaxy in the 500–600 °C temperature range. The regrowth rate was measured in situ by time resolved reflectivity, while the structure of the epilayers was investigated by transmission electron microscopy. Three regions can be distinguished in SiGe after solid phase epitaxy, independent of the annealing temperature: (1) a 20 nm defect-free layer close to the original crystal-amorphous interface, (2) a middle region with a high density of planar defects, and (3) a layer with dislocations and stacking faults extending up to the surface. The activation energy of the SiGe solid phase epitaxy is equal to the activation energy of Si except in the middle region. The amorphous-crystal interface evolution was studied by transmission electron microscopy of partially regrown samples. In order to study the effects of dopants, some samples were also implanted with B+ and Sb+ ions. At the ion projected range (125 nm for both implants) the regrowth rate increases by a factor of 3 with respect to the unimplanted SiGe, but the defect-free layer again is found to be about 20 nm in all cases. Moreover, the activation energy of the solid phase epitaxy regrowth process does not depend on dopant introduction, while the only observable effect of B or Sb incorporation is a smoothness of the amorphous-crystal interface during solid phase epitaxy. [ABSTRACT FROM AUTHOR]

In this work the lattice deformation induced by substitutional B in Si is carefully determined by using different experimental techniques. The investigated Si1-xBx/Si layers x=(0.0012÷0.005) are grown by solid phase epitaxy of B-implanted preamorphized Si and by molecular beam epitaxy. Nuclear reaction analysis both in random and in channeling geometry, secondary ion mass spectrometry and high resolution x-ray diffraction allow to quantify the total amount of B and its lattice location, the B depth profile and the B-doped Si lattice parameter, respectively. The reasons for the large spread present in the data reported so far in literature are discussed. Our results, thanks to the synergy of the earlier techniques, lead to a significantly more accurate strain determination, that is in agreement with very recent ab initio theoretical calculations. [ABSTRACT FROM AUTHOR]

In this paper we present a systematic study on the formation of He ion implantation induced nanovoids in Si and how they influence the self-interstitial (Is) supersaturation, thus affecting the diffusion and electrical activation of implanted boron in crystalline silicon. We implanted He ions into (100)-oriented Si wafers, with doses ranging from 5×1015 to 8×1016 He ions/cm2 and energies ranging from 25 to 110 keV. Then, we implanted B ions (12 keV, 5×1014 ions/cm2). All samples were annealed at 800 °C in N2 atmosphere. We demonstrated the role of nanovoids in reducing B diffusion already at the first stages of postimplantation annealing. The effect has been attributed to the Is trapping by the nanovoids that forces B to assume a boxlike profile. Moreover, we studied the nanovoid distribution as a function of He-implanted dose and energy, demonstrating, by means of Cu gettering experiments, the beneficial effect of increasing dose or decreasing energy of He implantation on the B diffusion and electrical activation. In fact, if the nanovoid density is high in the proximity of implanted B, implantation-related damage can annihilate at the internal dangling bonds of nanovoids, thus consuming the nanovoid layer. The potential of He coimplantation as a method for controlling point-defect distributions in crystalline Si is presented and critically discussed. [ABSTRACT FROM AUTHOR]

The article presents a complete analysis of the double sign anomaly of the Hall coefficient in the hydrogenated amorphous silicon (Si), which is usually formed by the plasma enhanced chemical vapor deposition technique. The various effects of the hydrogen content on the discussed anomaly are also studied.

The formation and growth of nanovoids in a C-doped Si layer after [He.sup.+] implantation and thermal annealing are described. The studies have shown how localized strain in epitaxial films can be effectively used to drive nanovoid formation and evolution.

The localization of voids in thin [Si.sub.1-x][Ge.sub.x] layers after [He.sup.+] implantation and thermal annealing is described. The results have shown that the compressive strain in the [Si.sub.1-x][Ge.sub.] layers have induced the nucleation of small cavities and the growth of voids by a mechanism where vacancies are stabilized by He.

The solid phase epitaxy regrowth (SPER) of strained [Si.sub.0.83][Ge.sub.0.17]/Si heterostructures grown by molecular beam epitaxy (MBE) and amorphized by [Ge.sup.+] ion implantation is studied. It is shown that the introduction of dopants such as B and Sb has increased the SPER rate but has no effects on the final quality and structure of the regrown SiGe in the activation energy for SiGe SPER process.

The localization of voids in thin Si1-xGex layers after He+ implantation and thermal annealing is reported. A Si/Si1-xGex multilayer grown onto (001) Si was implanted with He+ in the 10-30 keV range, with fluences from 7×1015 up to 1×1016 cm-2, and annealed at 800 °C for 1 h. Samples were analyzed by transmission electron microscopy, showing void formation only within the two layers containing Ge or at the film/substrate interface. Our results support the idea that the compressive strain in the Si1-xGex layers induces the nucleation of small cavities and the growth of voids by a mechanism where vacancies are stabilized by He. [ABSTRACT FROM AUTHOR]

The injection of Si self-interstitial atoms during dry oxidation at 815 °C of very shallow SiGe layers grown on Si (001) by molecular-beam epitaxy (MBE) has been investigated. We first quantified the oxidation enhanced diffusion (OED) of two boron deltas buried into the Si underlying the oxidized SiGe layers. Then, by simulating the interstitial diffusion in the MBE material with a code developed on purpose, we estimated the interstitial supersaturation (S) at the SiGe/Si interface. We found that S (a) is lower than that observed in pure Si, (b) is Ge-concentration dependent, and (c) has a very fast transient behavior. After such a short transient, the OED is completely suppressed, and the suppression lasts for long annealing times even after the complete oxidation of the SiGe layer. The above results have been related to the mechanism of oxidation of SiGe in which the Ge piles up at the SiO2/SiGe interface by producing a thin and defect-free layer with a very high concentration of Ge. [ABSTRACT FROM AUTHOR]

Germanium quantum dots (QDs) embedded in SiO2 or in Si3N4 have been studied for light harvesting purposes. SiGeO or SiGeN thin films, produced by plasma enhanced chemical vapor deposition, have been annealed up to 850 °C to induce Ge QD precipitation in Si based matrices. By varying the Ge content, the QD diameter can be tuned in the 3-9 nm range in the SiO2 matrix, or in the 1-2 nm range in the Si3N4 matrix, as measured by transmission electron microscopy. Thus, Si3N4 matrix hosts Ge QDs at higher density and more closely spaced than SiO2 matrix. Raman spectroscopy revealed a higher threshold for amorphous-to-crystalline transition for Ge QDs embedded in Si3N4 matrix in comparison with those in the SiO2 host. Light absorption by Ge QDs is shown to be more effective in Si3N4 matrix, due to the optical bandgap (0.9-1.6 eV) being lower than in SiO2 matrix (1.2-2.2 eV). Significant photoresponse with a large measured internal quantum efficiency has been observed for Ge QDs in Si3N4 matrix when they are used as a sensitive layer in a photodetector device. These data will be presented and discussed, opening new routes for application of Ge QDs in light harvesting devices. [ABSTRACT FROM AUTHOR]