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Amorphous diamond films have been prepared by filtered cathodic arc deposition of carbon. The filtered arc is well suited for the growth of amorphous diamond, as it provides carbon ions with optimum kinetic energies at practical deposition rates. These films contain no hydrogen and are therefore structurally different from diamond‐like carbon films generated by plasma chemical vapor deposition. Diamond‐type bonding of carbon is quantitatively determined by electron energy loss spectroscopy, as an sp3 content up to 83% is measured. Data on the macroscopic properties are provided by optical transmittance, ellipsometry, Rutherford backscattering, elastic recoil scattering, and resistivity measurements. The films exhibit high optical transparency and an optical gap of 2.4 eV. Trends in the optical gap and refractive index as a function of deposition energy are consistent with semiconductor theory and indicates a change in the average bond length.

We demonstrate the potential for ultrathin aluminum-oxide films as alternate gate dielectrics for Si complementary metal–oxide–semiconductor technology. Films are deposited in ultrahigh vacuum utilizing atomic beams of aluminum and oxygen on Si(100) surfaces. We show device-quality Si(100)/Al2O3 interfaces with interfacial trap densities in the 1010 cm−2 eV−1 range, and with leakage current densities five orders of magnitude lower than what is observed in SiO2 insulators at the same equivalent electrical thickness. As-grown films possess an amorphous-to-microcrystalline structure, depending upon the deposition temperature, and any interfacial layers between the Si(100) and Al2O3 layer are

Carbon thin films have been prepared by 248 nm excimer laser vaporization of graphite targets. The effect of a variety of process parameters on the film properties is investigated. Deposition at or below room temperature yields diamond‐like films with low hydrogen content, high optical transmission, and high resistivity. Electron energy loss spectra indicate sp3 bond fractions of 70–85%. Detailed analyses of the pseudodielectric functions, measured using spectroscopic ellipsometry, show the films to have normal dispersion and an index of refraction of 2.5 in the visible wavelength region. The effects of a low pressure hydrogen background and the use of auxiliary pulsed and dc plasma enhancements are also examined.

Trends in recently reported data on high sp3 fraction (up to 85%), nonhydrogenated amorphous diamond‐like carbon films deposited by ion beam sputtering and laser vaporization are examined. The degree of diamondlike film character is found to depend upon the deposition technique as well as the substrate temperature and thermal diffusivity. The data suggest that the combination of incident particle kinetic energy and surface accommodation determine the physical properties of the resultant film. A model is proposed for the condensation of energetic carbon atoms into diamondlike films in which a quench‐type surface accommodation mechanism is operative.

A process to deposit in situ a dual electron injector structure (DEIS) with 5‐nm SiO2 between two Si‐rich SiO2 (SRO) layers of ∼20 nm each has been developed. The excess silicon, as evaluated by Auger spectroscopy and Rutherford backscattering, was of the order of 15%–17%, in agreement with previously reported values under similar deposition conditions. Thin cross‐sectioned samples of DEIS structures, both as‐deposited and annealed at 1000 °C with Ar in an oxygen and water‐moisture‐free atmosphere, were examined by spatially resolved energy‐loss spectroscopy (EELS) in a scanning transmission electron microscope. The analysis has shown that the excess silicon is present either as nanometer‐sized silicon islands or as submicroscopic silicon oxides of varying stoichiometry resulting from intermediate oxidation states (i.e., Si+3, Si+2, and Si+1). Additionally, the thermal anneal at 1000 °C did not appear to have any effect on silicon island size of the SRO layer in contact with the silicon substrate. This su...

Strontium titanate, SrTiO3 (STO), thin films incorporated with lanthanum are grown on Si (001) substrates at a thickness range of 5–25 nm. Atomic layer deposition (ALD) is used to grow the LaxSr1−xTiO3 (La:STO) films after buffering the Si (001) substrate with four-unit-cells of STO deposited by molecular beam epitaxy. The crystalline structure and orientation of the La:STO films are confirmed via reflection high-energy electron diffraction, X-ray diffraction, and cross-sectional transmission electron microscopy. The low temperature ALD growth (∼225 °C) and post-deposition annealing at 550 °C for 5 min maintains an abrupt interface between Si (001) and the crystalline oxide. Higher annealing temperatures (650 °C) show more complete La activation with film resistivities of ∼2.0 × 10−2 Ω cm for 20-nm-thick La:STO (x ∼ 0.15); however, the STO-Si interface is slightly degraded due to the increased annealing temperature. To demonstrate the selective incorporation of lanthanum by ALD, a layered heterostructure ...

Using density functional theory, we analyze the wetting conditions for Pt on the (001) surface of ferroelectric BaTiO3 (BTO). We estimate the surface energy of (100), (110), and (111) Pt to be 2.42, 2.49, and 2.00 J/m2, respectively. We find the BTO surface energy to vary between 0.26 and 2.28 J/m2 depending on termination, polarization, and chemical environment. The interface energy between TiO2-terminated out-of-plane polarized BTO and (100) Pt is found to be between 1.64 and 2.62 J/m2, indicating that (100) Pt cannot wet BTO for this interface. A similar result is found for an interface with (110) Pt. Cross-sectional transmission electron microscopy of Pt films grown on BTO by molecular beam epitaxy with a low flux at high deposition temperature shows Volmer-Weber islands, consistent with first principles calculations.

An epitaxial layer of SrTiO3 grown directly on Si may be used as a pseudo-substrate for the integration of perovskite oxides onto silicon. When SrTiO3 is initially grown on Si (001), it is nominally compressively strained. However, by subsequent annealing in oxygen at elevated temperature, an SiOx interlayer can be formed which alters the strain state of SrTiO3. We report a study of strain relaxation in SrTiO3 films grown on Si by molecular beam epitaxy as a function of annealing time and oxygen partial pressure. Using a combination of x-ray diffraction, reflection high energy electron diffraction, and transmission electron microscopy, we describe the process of interfacial oxidation and strain relaxation of SrTiO3 on Si (001). Understanding the process of strain relaxation of SrTiO3 on silicon will be useful for controlling the SrTiO3 lattice constant for lattice matching with functional oxide overlayers.

We report on the stability of high-permittivity (high-k) TiO2 films incorporated in metal-oxide-silicon capacitor structures with a TiN metal gate electrode, focusing on oxygen migration. Titanium oxide films are deposited by either Ti sputtering [physical vapor deposition (PVD)] followed by radical shower oxidation or by plasma-enhanced atomic layer deposition (PEALD) from titanium isopropoxide (Ti{OCH(CH3)2}4) and O2 plasma. Both PVD and PEALD films result in near-stoichiometric TiO2 prior to high-temperature annealing. We find that dopant activation anneals of TiO2-containing gate stacks at 1000 °C cause 5 A or more of additional SiO2 to be formed at the gate-dielectric/Si-channel interface. Furthermore, we demonstrate for the first time that oxygen released from TiO2 diffuses through the TiN gate electrode and oxidizes the poly-Si contact. The thickness of this upper SiO2 layer continues to increase with increasing TiO2 thickness, while the thickness of the regrown SiO2 at the gate-dielectric/Si inter...