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Start Over Descriptor "COBALT plating" Journal journal of applied physics
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1. Properties of electrodeposited Co-Cu multilayer structures.

Author

Dariel, M., Bennett, L. H., Lashmore, D. S., Lubitz, P., Rubinstein, M., Lechter, W. L., and Harford, M. Z.

Subjects
*ALLOY plating, *COBALT plating, *COPPER plating, *ELECTROLYTES, *SURFACE roughness
Abstract

Reports on the electroplating of alternate layers of cobalt (Co) and copper (Cu) of individual thicknesses from an electrolyte having a low concentration of Cu and a high concentration of Co atoms. Electrodeposition technique used to prepare the Co-Cu composition modulated alloys; Investigation of the effects of surface roughness and layer interactions.

Published
1987
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