1. Surface Chemistry of Si:H:Cl Film Formation by RF Plasma-Enhanced Chemical Vapor Deposition of SiH2Cl2and SiCl4
- Author
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Tetsuji Ito, Koji Hashimoto, and Hajime Shirai
- Subjects
Physics and Astronomy (miscellaneous) ,Plasma-enhanced chemical vapor deposition ,Chemistry ,General Engineering ,Analytical chemistry ,Nanocrystalline silicon ,General Physics and Astronomy ,Deposition (phase transition) ,Substrate (electronics) ,Chemical vapor deposition ,Nanocrystalline material ,Volumetric flow rate ,Amorphous solid - Abstract
The surface chemistry of the Si:H:Cl film formation by rf plasma-enhanced chemical vapor deposition of SiH2Cl2 and SiCl4 systems is demonstrated at low tempeatures of 90–140°C. There exists a threshold substrate temperature Tth for the phase transition from amorphous to nanocrystalline silicon, nc-Si, which decreases from 110°C to 70°C with increasing H2 flow rate in the SiH2Cl2 system. On the other hand, Tth is almost independent of the H2 flow rate in the SiCl4 system along with a higher disorder in the a-Si network than in the SiH2Cl2 system. The degree of the chlorine termination in SiClx (x=1, 2) is at the growing top surface highly related to the degree of disorder in the Si-network. The disorder-induced phase transition to nanocrystalline is demonstrated from film deposition studies from the SiH2Cl2 and SiCl4 systems.
- Published
- 2003
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