38 results on '"Tanaka, Tetsu"'
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2. Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
3. Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics
4. Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system
5. Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window
6. Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber
7. Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces
8. Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties
9. Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system
10. Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC
11. Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC
12. Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration
13. Envelope tracking CMOS power amplifier with high-speed CMOS envelope amplifier for mobile handsets
14. Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis
15. Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain
16. Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration
17. Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration
18. Multilevel Charge Storage in a Multiple Alloy Nanodot Memory
19. Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability
20. Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application
21. A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density
22. Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
23. Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
24. Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
25. Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
26. Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
27. Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
28. Power Supply System Using Electromagnetic Induction for Three-Dimensionally Stacked Retinal Prosthesis Chip
29. New Reconfigurable Memory Architecture for Parallel Image-Processing LSI with Three-Dimensional Structure
30. Electrical Characterization of Metal–Oxide–Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots
31. Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate
32. Novel Optical/Electrical Printed Circuit Board with Polynorbornene Optical Waveguide
33. Evaluation of Platinum-Black Stimulus Electrode Array for Electrical Stimulation of Retinal Cells in Retinal Prosthesis System
34. Low Power Spin-Transfer Magnetoresistive Random Access Memory Writing Scheme with Selective Word Line Bootstrap
35. New Magnetic Nanodot Memory with FePt Nanodots
36. Highly Reliable Dynamic Random Access Memory Technology for Application Specific Memory with Dual Nitrogen Concentration Gate Oxynitrides Using Selective Nitrogen Implantation
37. Erratum: “A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density”
38. Analytical Models for Symmetric Thin-Film Double-Gate Silicon-on-Insulator Metal-Oxide-Semiconductor-Field-Effect-Transistors
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