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The focus of the present paper is on the mode-II (shear mode) interlaminar fracture of laminated composite materials with randomly distributed defects such as those generated due to the manufacturing process. The study is conducted using cohesive-zone Finite Element (FE) models of the Interlaminar Shear (ILS) and the End Notch Flexure (ENF) geometries with explicit inclusion of defects on a representative interlaminar plane. The effective interlaminar shear strength and the effective mode-II fracture energy are obtained by comparing the FE analysis with explicit defects against corresponding homogeneous models. Based on the parametric FE results it was found that the effective ILS strength and the mode-II fracture energy are significantly affected by the defects present on the critical interlaminar fracture plane, and when the defects are small, they follow a linear scaling with the defect area fraction. Simulations with various defect sizes reveal that for defects larger than the size of the delamination process-zone, the concept of the effective ILS strength and effective mode-II fracture energy is not valid, and defects must be represented explicitly in the models. [ABSTRACT FROM AUTHOR]

Delamination is often identified as an important failure mechanism in structures with a high interface density, such as modern microelectronic systems and advanced composite materials. Delamination tests performed on different interface structures reveal complex failure mechanisms (crack bridging, fibre pull out, micro-void coalescence, fibrilation, crack meandering, etc.) in the fracture process zone that lead to an irreversible unloading response of the interface, ranging from full damage to full plasticity. Modeling the unloading response of an interface is important for predicting phenomena such as crack branching and crack propagation at multiple interfaces. This paper presents a 2D irreversible combined plasticity-damage unloading model, which can be used to extend the cohesive zone (loading) models with a proper unloading description that is suitable for modeling the entire loading-unloading response in the process zone. The presented model is able to capture changes in unloading behavior as a function of mode mixity, whereas it introduced only two additional model parameters that can be determined from dedicated delamination experiments. As a demonstration, the improved Xu–Needleman cohesive zone law has been extended with the proposed combined damage-plasticity unloading formulation. Numerical simulations with this extended model are performed for a glue interface system, recovering the typical observed behavior in delamination experiments. Finally, a complete procedure to extract all CZ model parameters is presented and illustrated for the glue interface system. [ABSTRACT FROM AUTHOR]

Design and manufacture of composite test specimens with two embedded delaminations subjected to transverse tension is described in this paper. The behaviour of the specimens has been investigated through experimental testing and finite element analyses. Fracture mechanics approaches were applied to predict the initiation and growth of delaminations and the degradation of the load carrying capacity of the specimens. Models were generated in the FE software programs MSC.Nastran and Abaqus. The MSC.Nastran model was used to calculate strain energy release rates employing a crack tip element methodology. The Abaqus model was evaluated using the virtual crack closure technique. The accuracy of numerical solutions was established by qualitative and quantitative comparisons with the experimental measurements, the results obtained from the ultrasonic non-destructive inspections and microscopic examination. It was shown that fracture mechanics can be used to accurately predict the failure initiation locations and failure loads of composite specimens containing multi-level delaminations. [ABSTRACT FROM AUTHOR]

In this paper nonlinear cohesive fracture models with cohesive parameters and laminar elasticity typical of polymer composites are used to study the initiation and propagation of a transverse intra-ply crack that is coupled to possible delaminations at the ply interfaces in a [0/90/0°] laminate. The evolution of the transverse crack is found to be more complex than previously described, involving initial growth, growth along the ply in a tunneling mode, and expansion across the thickness of the ply in a plane strain mode. For the coupled crack system, two failure modes are distinguished: (1) complete tunneling propagation of the transverse crack before any delamination occurs, followed by delamination initiation and propagation; and (2) simultaneous propagation of the transverse and delaminations cracks. The former process is always stable, is favored by large values of the mode II to mode I toughness ratio and low values of the cohesive strength, and is predicted to be the prevalent failure sequence for polymer composites. The latter process is often unstable, because it tends to occur when the cohesive strength is so high that the stress for initiating the transverse crack exceeds the stress required for its tunneling propagation. The nonlinear fracture models provide a unified description of the entire process of initiation and crack propagation. If the delamination cracks are modeled by linear elastic fracture mechanics, substantially inaccurate predictions result for the onset of delamination cracking and for the tunneling crack initiation from a pre-existing flaw. [ABSTRACT FROM AUTHOR]

In this paper, the durability of the bondline between concrete and FRP reinforcement was characterized at various temperature and humidity levels. The linear and nonlinear viscoelastic constitutive behavior of the epoxy bondline was characterized and used for a nonlinear viscoelastic fracture analysis of delamination. A hygrothermal nonlinear viscoelastic pseudo-stress model was developed and calibrated in order to compute a generalized J integral. Driven wedge tests were conducted for examining the fracture behavior of the interface. A finite element analysis was developed for determining the cohesive zone size and the generalized J integral at various temperature and humidity levels. The fracture energy obtained from these parameters greatly depended upon crack growth rate, temperature and humidity. [ABSTRACT FROM AUTHOR]

The phenomenon of edge fractures is analyzed using a fracturing process approach. Such fractures often initiated from the free surface of layered materials, and often terminate at the interface that divides the fractured layer and the matrix layer, or continue to expand along the interface, or create a peel-crack. To understand better the pattern of fractures with different spacing and the fracture mechanism, a double-layer elastic model with the same material properties with a fractured overlying layer subjected to uniaxial tension is simulated firstly. The stress distribution between two adjacent fractures is periodically distributed as a function of the ratio of the fracture spacing to the thickness of the fractured layer (S/t ratio), and homogeneous and heterogeneous material properties are considered in the simulation. The simulation results show that both the stress distribution and the critical value of fracture spacing to layer thickness ratio are affected by material heterogeneity; the S/t ratio of heterogeneous material is much smaller and it is much easier to crack compared with the homogeneous materials. In particular, the fracture saturation mechanism is analyzed by stress state change. Then a numerical simulation is carried out to reveal the fracturing process from micro-fracture formation, propagation, coalescence, nucleation, fracture infilling, fracture saturation, termination, to interface delamination. A fitting curve of the relationship between strain and spacing to layer thickness radio is obtained. It is found that infilling fractures may grow near the bottom or the free surface of the fractured layer by coalescence of micro-fractures and flaws. We also find that fracture spacing in the case of interface delamination is greater than that without interface delamination. A study of stress transition between the two layers on fracture spacing in the fracture process is also carried out, with a focus on stress transfer mode. [ABSTRACT FROM AUTHOR]

ERRATUM: This paper is an identical reprint of an article published in Engineering Fracture Mechanics, Vol. 61, 163–171 (1998). Due to unforeseen circumstances this article was published again in a special issue of the International Journal of Fracture. The Editor-in-Chief and the publisher regret this unfortunate turn of events. The publication in Engineering Fracture Mechanics is to be regarded as the initial one and therefore the only valid publication of the article. [ABSTRACT FROM AUTHOR]

Thermoelectric thin film/substrate structures have many practical applications such as in heat recovery systems. The general problem of thermally induced delamination between a thermoelectric thin film and a substrate is investigated. The temperature varies along the length direction but is constant along the thickness direction of the film. Analytical solutions of the temperature field in the film and the stress intensity factors (SIFs) at the delamination crack tips are obtained. The combined heat convection and heat radiation between the film surfaces and the surrounding medium (i.e., the air) are taken into account. Numerical results show that the SIFs sharply increase as the tips of the delamination crack approach the ends of the film. The combined heat convection and heat radiation can increase or decrease the SIFs. The mechanism for the delamination propagation in the thermoelectric film/substrate system is examined. The critical (permissible) temperature difference across the film governing the delamination propagation is identified. [ABSTRACT FROM AUTHOR]

The energetics controlling delamination versus echelon crack advance in a tape composite laminate subjected to anti-plane shear loading are studied. The finite element method is used to model both single and multiple echelon cracks that intersect the planar delamination front. Energy release rates are determined along the echelon crack peripheries and along the planar delamination front. Various echelon crack shapes are evaluated in order to represent progressive stages of growth. It is shown that the echelon cracks advance due to primarily mode I conditions, whereas a mode III criterion is appropriate for predicting advance of the planar delamination. It is further shown that mode I advance of the echelon crack and mode III advance of the delamination are competing yet coupled processes, and that the sequence of events predicted by this approach agrees with what has been observed experimentally. [ABSTRACT FROM AUTHOR]

A discrete damage zone model is developed to describe the mode-mix ratio and temperature dependent delamination of laminated composite materials under high cycle fatigue loading within the framework of the finite element method. In this approach, discrete nonlinear spring elements are placed at the finite element nodes of the laminate interface, and a combination of static and fatigue damage growth laws is used to define its constitutive behavior. The model is implemented in the commercial software Abaqus using the user element subroutine. The static damage model parameters are estimated from fracture mechanics principles, whereas the fatigue damage model parameters are calibrated by fitting the numerical results to published experimental data. A quadratic relation is proposed to describe the non-monotonic variation of fatigue damage model parameters with mode-mix ratio. Next, an Arrhenius relation is proposed for the temperature dependence of fatigue damage, in addition to the incorporation of the temperature dependence of critical fracture energy. The model is convergent upon mesh refinement; however, for accurate prediction the mesh size used for model calibration should be sufficiently small. The model predicted fatigue crack growth rates are in agreement with those obtained from a quadratic relation for the Paris law parameters for variable mode mix conditions, thus verifying the approach. While the model captures the temperature effects on delamination for mode I and 50 % mode II, our prediction deviates from experiments for pure mode II, since the corresponding damage mechanism entirely changes with temperature. [ABSTRACT FROM AUTHOR]

We present an analytical investigation of a test protocol recently developed to extract the fracture toughness of thin films used in microelectronics and other engineering applications. The testing method involves the dynamic delamination of patterned thin films initiated by a laser-induced pressure pulse applied on the backside of the substrate. The kinetic energy imparted by the pulse to a weakly bonded (pre-cracked) region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion over multiple milimeters. To support these experiments and extract the interface fracture toughness values, we develop a numerical scheme based on the combination of a nonlinear beam model used to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the spontaneous propagation of the delamination front. The accuracy of the beam model is assessed through a comparison with the results of a more complex 2D hybrid spectral/finite element scheme. Numerical results are compared with experimental measurements of the delamination length and the outcome of a parametric study of some of the key geometrical and loading quantities defining the delamination event is presented. [ABSTRACT FROM AUTHOR]

A double cantilever beam specimen loaded with uneven bending moments (DCB-UBM) is proposed for mixed mode fracture mechanics characterisation of adhesive joints, laminates and multilayers. A linear elastic fracture mechanics analysis gives the energy release rate and mode mixity analytically for both isotropic and orthotropic materials. By varying the ratio between the two applied moments, the crack tip stress state can be varied from pure mode I to pure mode II for the same specimen geometry. The specimen allows stable crack growth. A special test fixture is developed to create uneven bending moments. As a preliminary example, the DCB-UBM specimen was used for characterising fracture of adhesive joints between two laminates of thermoset glass fibre reinforced plastic. [ABSTRACT FROM AUTHOR]

Experiments are carried out to determine the delamination toughness for a crack along the interface between two transversely isotropic materials. The material chosen for study consists of carbon fibers embedded within an epoxy matrix. A crack is introduced between two layers of this material, with fibers in the upper layer along the + 45°-direction and those in the lower layer along the − 45°-direction both with respect to the crack plane. The Brazilian disk specimen is employed in the testing. To calibrate the specimens, stress intensity factors are obtained which result from the applied load, as well as residual curing stresses. It may be noted that all three modes are coupled, leading to a three-dimensional problem. The finite element method and a mechanical M-integral are employed to determine the stress intensity factors arising from the applied load. For the residual stresses, a three-dimensional conservative thermal M-integral is presented for stress intensity factor determination. The stress intensity factors found for the applied load and residual stresses are superposed to obtain a local energy release rate, together with two phase angles. From the load at fracture, the critical interface energy release rate or interface toughness $${{\mathcal G}_{ic}}$$ as a function of phase angles ψ and ϕ is determined. Results are compared to a fracture criterion. [ABSTRACT FROM AUTHOR]

Two distinct cohesive layer models are developed for numerical simulation of delamination growth in composite layered specimens tested under static loading. One of these designated as the UMAT (user supplied material) model has a small, but finite thickness and the other designated as the UEL (user element) model has zero initial thickness. Crack growth in double cantilever beam specimens as well as in two test configurations of a composite plate carrying some discontinuities subjected to lateral load are studied using the models. It turns out that UEL model, though slightly more involved, is able to predict both crack initiation and large crack growth with sufficient accuracy. The UMAT model too consistently predicts crack initiation, but is unable to predict the crack growth accurately. It gives consistently higher loads for given crack extensions and predicts that the crack growth shuts off prematurely. Careful examination of the stresses in the cohesive layer of the UMAT model, in the upstream of the crack tip indicates that a ‘neck’ develops due to compressive stresses at some distance from the crack tip. Apparently it is the formation of this neck that ‘locks’ the crack from growing and is the cause of the inaccurate results given by the model. [ABSTRACT FROM AUTHOR]

A direct energy balance approach has been developed and used to determine energy release rates in three and four point bend end notched flexure tests. This study was performed in the context of the larger goal of understanding the wide variation in mode II toughnesses that have been obtained by the two tests when used on the same material. The primary motivation for developing the direct energy balance approach was to fully account for the effects of friction, large deformations, and other geometric nonlinearities that occur during these tests. The direct energy balance approach simulates crack advance as it occurs in physical testing. Most significantly, this approach accounts for frictional dissipation that occurs during crack advance, which is an effect that has been neglected in previous analyses of these tests. The direct energy balance approach is used to show that, for most cases of practical interest, the virtual crack closure technique is quite accurate, and predictions by this latter approach are only in error when moderately large geometric nonlinearities occur prior to crack advance. Based on these results, a “cut-off value,” expressed in terms of the maximum slope in the specimen as predicted by classical beam theory, is suggested for the upper limit of applicability of the virtual crack closure technique. [ABSTRACT FROM AUTHOR]

Temperature- and moisture- induced delamination leading to popcorn package cracking is a major package reliability issue for surface-mount plastic encapsulated microcircuits (PEM). Crack propagation along one of the interfaces of a ductile adhesive joining two elastic substrates is modeled to study interface delamination and toughness of PEMs. The polymeric adhesive is stressed by remote loading and residual stress. Along the crack front, the film-substrate interface is modeled by a strip of cells that incorporates vapor pressure effects on void growth and coalescence through a Gurson porous material relation. Results show that under high levels of vapor pressure, increasing film thickness will produce smaller enhancement on the steady-state fracture resistance of the interface, also referred to as the joint toughness. Across all mode mixity levels, vapor pressure effects dominate over residual stress. The adverse effects of vapor pressure are greatest in highly porous adhesives subjected to a strong mode II component. The latter is representative of the likely state of loading in IC packages since residual stress, resulting from the film-substrate thermal mismatch, induces a predominantly mode II component. [ABSTRACT FROM AUTHOR]

Steady-state tunneling and plane-strain delamination of an H-shape crack are examined for elastic, isotropic multi-layers. Both tunneling and delamination are analysed by employing linear elastic fracture mechanics within a 2D finite element framework. Failure maps are produced to reveal the sensitivity of cracking path to the relative toughness of layer and interface, and to the stiffness mismatch of layers. Closed-form expressions are derived for the critical stress level for steady-state plane-strain delamination. By means of a comparison with experimental results taken from the literature, it is demonstrated that these expressions serve as useful design criteria for elastic multilayers. [ABSTRACT FROM AUTHOR]

In this investigation, the conservative M-integral is extended to treat thermal-elastic, mixed mode problems. With it, stress intensity factors are obtained for cracks in homogeneous, isotropic materials, as well as isotropic and anisotropic, bimaterials. Excellent agreement is found between results determined in this study and those found in the literature. In addition, new results are obtained for interface cracks for a wide range of material properties and for a delamination in a composite material. [ABSTRACT FROM AUTHOR]

Carbon fiducial marks are formed during thin film local delamination processes induced either by superlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO2 and TiWXNY/GaAs. TiWXNY/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations. [ABSTRACT FROM AUTHOR]

Length scales are essential to the understanding of small volume deformation and fracture in emerging technologies. Recent analysis by two groups at the atomistic (Horstmeyer and Baskes, 1999) and mesoscopic (Gerberich et al., 2002) levels have shown the importance of the volume to surface ratio to the indentation size effect (ISE) at small depths of penetration. We have interpreted this in terms of the plastic work under the contact and the surface work associated with the creation of new surface or the excess surface stress. Treating this as a modified Griffith criterion the case is made that this same length scale should apply to the delamination of thin films. By making this simple equivalency in length scales, an R-curve analysis for crack growth resistance, GR, in thin film delamination emerges. This recovers the classic σ2ysh/E term as well as the fact that interfacial toughness should scale with the square root of incremental crack growth. Here σys is yield strength, h is thickness and E is modulus of the film. As applied to thin Cu and Au films bonded to silicon substrates, the model is in good agreement. [ABSTRACT FROM AUTHOR]