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This work studies the influence of substrate loss on the performance of acoustic resonators and on-chip inductors and investigates the effective substrate resistivity of seven commonly used substrates in silicon-based devices. The substrates include X-cut lithium niobate (LiNbO3) film with two different thicknesses (400 nm and 1.6 $\mu \text{m}$) on high-resistivity Si (HR-Si) and amorphous Si wafers, SiO2 film with two different thicknesses on HR-Si, and bare HR-Si. The effective resistivities of these substrates are extracted using coplanar waveguides (CPWs) over a frequency range from 1 to 40 GHz. Using the effective resistivity approach, the efficiency of two substrate loss reduction techniques—Si wafer removal and amorphous Si—in reducing substrate loss is quantified. Comparison of the extracted substrate resistivities of the suspended and un-suspended dielectric-on-Si structures and comparison of LiNbO3 on HR-Si and amorphous Si are carried out. Substrate loss reduction techniques are more advantageous for a thinner dielectric film and at a lower frequency range due to the higher filling factor of the electric field in the Si wafer. Finally, by comparison of the effective substrate resistivity of SiO2 film on an HR-Si with bare HR-Si, thick plasma-enhanced chemical vapor deposition (PECVD) SiO2 film is found to be a good insulation layer to reduce substrate loss. [ABSTRACT FROM AUTHOR]

This article presents the design approach and the first demonstration of a wideband hybrid monolithic acoustic filter in the K-band, which exceeds the limitation of electromechanical coupling on the fractional bandwidth (FBW) of acoustic filters. The hybrid filter utilizes the codesign of electromagnetic (EM) and acoustic to attain wide bandwidth while keeping the advantages of small sizes and high Q in the acoustic domain. The performance trade space and design flow of the hybrid filter are also presented in this article, which allows this technology to be applied for filters with different center frequencies and FBWs. The hybrid filter is simulated by hybridizing the EM and acoustic finite element analysis, which are carried out separately and combined at a system level. The fabricated filter built with resonators having an electromechanical coupling of 0.7% based on the seventh-order antisymmetric Lamb wave mode (A7) has a 3-dB FBW of 2.4% at 19 GHz and a compact footprint of 1.4 mm2. [ABSTRACT FROM AUTHOR]