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This paper presents a low-cost heterogeneous integration technology combining the previously developed bumpless radio-frequency (RF) system-on-a-package scheme with a special surface cleaning process to assemble a complementary metal–oxide–semiconductor chip with an organic substrate (SU-8/ polydimethylsiloxane) by low-temperature Au–Au thermocompressive bonds (< \200\ ^\circ \C) for flexible wireless microsystem fabrication. The RF performance of -15 dB return loss and -0.25 dB insertion loss at 40 GHz and above 6 MPa bonding strength of a microstrip-to-coplanar-waveguide interconnect transition between the chip and the substrate make the technology practical for flexible wireless microsystem integration. [ABSTRACT FROM PUBLISHER]