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Your search keyword '"Electronic packaging -- Methods"' showing total 2 results
Start Over Descriptor "Electronic packaging -- Methods" Journal ieee transactions on components and packaging technologies
2 results on '"Electronic packaging -- Methods"'

1. Adhesion issues in flip-chip on organic modules

Author

Tran, Son K., Questad, Dave L., and Sammakia, Bahgat G.

Subjects
Organic superconductors -- Equipment and supplies, Electronic packaging -- Methods, Solder and soldering -- Methods, Semiconductor chips -- Models, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

The ability of semiconductor chips to attached to organic carriers is evaluated. An analysis of the reliability of underfills is presented, and the results of adhesion disintegration on flip chip assembly procedures are discussed.

Published
1999

2. A novel flip chip technology using nonconductive resin sheet

Author

Ito, Satoshi, Mizutani, Masaki, Noro, Hiroshi, Kuwamura, Makoto, and Prabhu, Ashok

Subjects
Microelectronic packaging -- Innovations, Electronic packaging -- Methods, Microelectronics -- Packaging, Epoxy resins -- Usage, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

The use of epoxy base resin sheets in microelectronic packaging is examined. Advantages to using nonconductive resins in packaging include maintenance of materials' thermal stability, ability to introduce moisture without damaging materials, and improved thermal shock performance.

Published
1999

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