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This paper reports a novel composite glass-silicon substrate (CGSiS) embedded with microcomponents by a glass reflow process. Microcomponents including vias, electrodes, capacitors, inductors, and filters are designed. Highly doped silicon is taken as the conductive material of microcomponents. Glass reflow process is investigated to fabricate the CGSiS. Results show that the total thickness variations of three composite substrates by an improved planarization method are smaller than $10 ~\mu \text{m}$. The surface roughness of silicon and glass after polishing is below 0.5 nm. The silicon conductivities of two composite substrates are $5.35 \times 10^{-3}$ and $3.34 \times 10^{-3}\,\, \Omega \cdot \text {cm}$ , respectively. Micropassives, vias, and electrodes are successfully embedded in the CGSiS. The CGSiS embedded with microcomponents shows great potential for MEMS 3-D integration. [ABSTRACT FROM AUTHOR]

In this paper, the broadband Green’s function with low wavenumber extraction (BBGFL) is applied to modeling of traces connecting vias in arbitrarily shaped power/ground planes of printed circuit boards (PCBs). The proposed modeling method is a hybrid technique based on mode decomposition: BBGFL is used to fast compute the vias in power/ground planes, MoM is used to calculate the impedance matrix of the traces, and a physical circuit model is then applied to combine the vias and traces in the power/ground planes. The present method is compared to the method of moments (MoM) and the commercial tool HFSS. Results show that the results of the present technique are in good agreement with MoM and HFSS on the radiated emissions from PCBs. BBGFL is several hundred times faster than HFSS in CPU time for broadband simulations. The technique provides a fast broadband solution for system-level modeling of high-speed interconnects with vias and traces in electronic design automation design and applications. [ABSTRACT FROM AUTHOR]

In this paper, we model multiple vias with irregular antipad in arbitrarily shaped 3-D integrated circuit and packaging system based on generalized Foldy–Lax equations method, boundary integral equation method, and generalized T matrix. We first obtain the impedance matrix for finite cavity, which includes the reflection features of the cavity boundaries. Then, the scattered field from a single via and a generalized T matrix, including the wall effects, are derived. The Foldy–Lax multiple scattering equations are generalized to include the wall effects using impedance matrix and the generalized T matrix. To obtain the incident field for the case of vias in the arbitrarily shaped antipad, we calculate the exciting and scattering field coefficients based on the transformation that converts surface integration of magnetic surface currents in antipad into 1-D line integration of surface charges on the vias and ground plane. The coupling among vertical vias are solved by applying Foldy–Lax multiple scattering equations. The scattering matrix of coupling among vias is calculated to make corresponding signal/power integrity analysis. Numerical results for the method are in a good agreement with a commercial full-wave numerical tool up to 50 GHz. [ABSTRACT FROM PUBLISHER]

This paper proposes an equivalent circuital model to describe the electrical propagation along nanoscale interconnects, made either by carbon nanotubes or graphene nanoribbons. The circuital models are derived from an electrodynamical model for the transport of conduction electrons, and are expressed in the frame of the classical transmission line theory. The per-unit-length parameters, despite their simple expressions, retain the main phenomena occurring at nanoscale, such as the kinetic and quantum effects. In addition, the circuit parameters are expressed as functions of the temperature and the transverse size of the interconnect, thus allowing a qualitative and quantitative analysis of their impact in the electrical performance of the interconnects. The models are used to study some challenging problems in nanopackaging, such as the degradation of electrical performance due to self-heating and the high-frequency current crowding problem because of the skin-effect. Interconnects and vias are analyzed, referring to the 14-nm technology node. [ABSTRACT FROM PUBLISHER]

We consider multiple scattering among different groups of vias with each group of vias sharing one antipad in planar waveguide. A transformation is used that converts the 2-D discretization and 2-D surface integration of the product of Green's functions and magnetic surface currents into 1-D discretization and 1-D integration of surface charges on the vias and on the ground plane. This is used to calculate the incident fields onto the vias. Based on the incident fields, the Foldy–Lax equations can be solved to calculate the circuit parameters for the problem. We show that the results are superior to the previously used finite difference method. In addition, the group T-matrix method is used to represent a group of vias to account for the scattering among different groups of vias. Results are illustrated for various cases of multiple vias up to 20 GHz. Results show the accuracy of the method even to very closely spaced vias when they are separated by merely 1 mil. Numerical results are in excellent agreement with ANSOFT HFSS. [ABSTRACT FROM AUTHOR]