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The unknown statistical distributions of two effective elastic properties of Sn-3.0Ag-0.5Cu solder joint of leadless chip resistors (LCRs), induced by an assembly condition, are determined by the advanced statistical model calibration. Two key elements are involved in the model calibration: an uncertainty propagation (UP) analysis and an optimization process using a calibration metric. In this paper, the UP analysis utilizes an advanced approximate integration method, which allows us to take into account the statistical variations of six additional known input variables, including die thickness, solder joint height, termination length, and thickness and elastic moduli of a printed circuit board. The cyclic bending test results of LCR assemblies are used in conjunction with the maximum-likelihood metric to obtain the statistical distributions of the effective properties. The cycles-to-failure distribution of the identical LCR assemblies subjected to a different loading level is predicted accurately by the calibrated model, which corroborates the validity of the proposed approach. [ABSTRACT FROM AUTHOR]

Low-temperature Cu–Cu bonding utilizing pillar and concave on silicon substrate with and without polymer layer is successfully implemented at 200 °C under atmospheric pressure. Finite-element method (FEM) simulations on stress and deformation generated during bonding process are also presented in order to discuss their influence on bonding result of several pillar diameters and of concave sidewall angles originating from the manufacturing process. The alteration of parameters in FEM simulations would also be investigated to enhance the bonding outcome. The parameters include the diameter of pillar, the sidewall angle of concave, the shape of the concave opening, the addition of extra polymer layer under Cu concave layer, the bonding temperature, and the pitch of the pillar–concave structure. The implementation of Cu–Cu bonding using pillar–concave structure could have a prospective effect on existing packaging methods in semiconductor industry with benefits of applicability to various sorts of substrates and low bonding temperature. [ABSTRACT FROM PUBLISHER]

Although chip-level heterogeneous integration has high yield for production, low-throughput issue of chip-to-wafer bonding is necessary to be improved. Due to the uneven topography and small chip size, handling issue and alignment accuracy are important factors that impact the difficulty in heterogeneous integration. Self-assembly technology has a high potential to be applied in 3-D heterogeneous integration. By using hydrophobic film to define the stacking area, hydrophilic chips can be assembled to realize alignment process on these areas through wafer surface tension in a very short time. With this concept, double-self-assembly technology is accomplished to resolve both handling and alignment issues for uneven-topography-chip integration. In this paper, different chip sizes of $\mu $ -pillar are simulated to investigate the optimal water volume for double-self-assembly process. High alignment accuracy of misalignment measurement can be accomplished with the optimal water volume. Furthermore, microstructure of Cu/In bonded structures and corresponding electrical analyses are evaluated, while various reliability tests are investigated for bonding quality. Excellent results verify that the double-self-assembly technology could be applied to 3-D heterogeneous integration for uneven-topography-chip integration. [ABSTRACT FROM AUTHOR]

As IC components become denser and smaller in a package, more problems emerge. In the mold filling process, because epoxy molding compound (EMC) contains approximately 80 wt.% silica fillers, the fillers may clog at the gate of gap if the gap height between the component and the substrate is too small. This clogging will cause a popcorn effect due to the high resin content in the gap. In order to determine the EMC filling process in the mold cavity and the relation between the gap height and the filler size, we simulate the EMC filling process and the EMC filler concentration distribution in the mold cavity using mold flow analysis software and then use computational fluid dynamics-discrete element method (CFD-DEM) coupling method to simulate the EMC filler motion to determine the relationship between gap height and filler size and the factors that affect filler clogging. Based on the mold flow analysis results, the filler concentration was higher at the gate of gap than in other regions, and the filler concentration at the gate of gap for the 30- $\mu \text{m}$ gap-height model was higher than that for the 50- $\mu \text{m}$ gap-height model. Based on the DEM-CFD coupling results, particles with a single diameter larger than one-half of the gap height caused particle clogging the gate of gap, and particles with a mean particle size larger than one-third of the gap height caused particle clogging the gate of gap. [ABSTRACT FROM AUTHOR]

With the advantage of high surface-roughness tolerance, the pillar–concave Cu–Cu direct bonding without chemical-mechanical planarization (CMP) is investigated in detail, including the mechanism of thermal compensation, analysis of roughness, bonding strength, and bonding reliability. With the special design of Cu bond structure, excellent bonding results can be achieved under low thermal budget (150 °C for 1 min, atmosphere) with even high roughness of bonding surface. In addition, the pillar–concave scheme applied to fan-out panel-level package (FOPLP) has been demonstrated, showing the high feasibility of this scheme to realize applications in heterogeneous integration. [ABSTRACT FROM AUTHOR]