5 results on '"Yang, Yu"'
Search Results
2. Low-Temperature Cu–Cu Direct Bonding Using Pillar–Concave Structure in Advanced 3-D Heterogeneous Integration.
3. Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration.
4. Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process.
5. Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.