Search

The recently developed mode-selective transmission line (MSTL) is proposed and exploited as an alternative approach to accommodate the growing and future ultrafast interconnects requirements of ultralarge-scale integration for high density, speed, performance, and bandwidth (BW). A parametric study is performed to optimize the MSTL structure for high-speed global interconnects and to provide high-performance signal integrity. Picosecond and rectangular pulse propagations on MSTL are examined, and pulse distortion, broadening, ringing, and reflection are characterized. An eye diagram is also shown to examine the jitter and noise. Due to our limited low-cost printed circuit board (PCB) fabrication accuracy, the frequency-domain measurement is carried out up to 110 GHz. Our optimal fabricated MSTL structures show an ultrawide absolute BW covering dc, maintain more than 200% relative BW while transmitting around 90° bends, and achieve a measured crosstalk of better than −45 dB over the entire band. Time-domain characterizations imply that the PCB-based MSTL accommodates data rates greater than 200 Gb/s. This technology allows, for the first time, the transmission of ultrahigh-speed electrical signal and picosecond pulse transmission through global interconnects with much lower dispersion and loss than today’s technologies. [ABSTRACT FROM AUTHOR]

This paper proposes a robust option for developing a new class of efficient and cheap antenna array based on patch array fed by substrate-integrated waveguide (SIW) through slot apertures for wireless backhauling applications. It consists in performing the feed network in SIW and the radiating structure in microstrip technology. The microstrip lines are coupled to the slots on the top wall of the SIW. Hence, it is demonstrated that the best alternative of the costly, heavy, and bulky rectangular waveguide feeder is SIW, which provides miniaturization, cost reductions, performance enhancements, and easy integration with patch array antennas. The experimental prototype presented in this paper demonstrates the efficiency of the design method and the feasibility of creating low-cost moderate-bandwidth millimeter-wave planar $8\times 8$ patch antenna array configurations in two stacked substrates to get ultracompact antenna module. The principle of achieving such high-quality antenna array is presented in detail along with experimental verification of theoretical results to validate the design procedure and demonstration of the feasibility of implementing the array by means of relatively inexpensive compact structures. The maximum gain is around 23 dBi at 22.4 GHz, the measured impedance bandwidth is 5%, and the efficiency is around 70%. [ABSTRACT FROM PUBLISHER]

We investigate the application of perfect magnetic conductor (PMC) packaging for a nonsmooth perfect electric conductor surface, caused by metalized via holes. The PMC shielding is artificially built by a metal lid of pins, based on the gap waveguide (GW) technology. As a foundation, the effects of via hole in a unit cell are studied first considering its diameter, substrate thickness, pin size, pin height, as well as relative position between the via hole and the pin. The via adjacent space and pin rows are also considered for a general grounded coplanar waveguide along with ground vias. The effectiveness of package for such a transmission line containing metalized via holes is then verified experimentally. It is shown that the measured performance agrees well with the simulation. This paper presents a guideline for the GW-based PMC packaging technology. [ABSTRACT FROM AUTHOR]

A novel surface-mounted monoblock high Q dielectric filter is presented in this paper. The proposed filter is constructed on the basis of a surface-metalized dielectric monoblock and is surface mountable on a printed circuit board (PCB) by means of a reflow process. The monoblock dielectric filter can be easily manufactured by mold casting. Metal caps on the surface and through holes in dielectric body are introduced for tuning capability. The input/output coupling is realized by inserting a stepped probe into the dielectric cavity through a via structure on the PCB. A novel electric coupling method using microstrip line is presented for easy control of coupling coefficient by adjusting the length and width of the microstrip line and flexible routing of cross couplings. One prototype 8-2 surface-mounted monoblock dielectric filter operating at 1.9 GHz with 84 MHz bandwidth is designed, fabricated, and measured. The measured insertion loss at center frequency is 0.73 dB with 0.6 dB ripple and corresponding unloaded Q factor of around 1700, demonstrating that the proposed filter architecture is applicable to a radio front-end of advanced wireless communication systems. [ABSTRACT FROM AUTHOR]