1. The Effect of Edge Metal Profiles on the Accuracy of Electrical Modeling of Advanced Packages.
- Author
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Kaw, Ravi, Burton, Scott, Ching-Chao Huang, and Luk, Clement
- Subjects
COMPUTER-aided design ,COMPUTER-aided engineering ,ELECTRONICS packaging ,ELECTRONIC equipment ,ELECTRONIC packaging ,ELECTRONICS - Abstract
Electronic package edge metal profiles have an effect on package characteristics on an order increasingly close to the tolerances expected for the package electrical performance. Several two-dimensional (2-D) tools are available that can be used to evaluate predesign and layout issues with nonrectangular edge profiles. However, tools that extract models from actual designs using the most up-to-date computer-aided design/computer-aided engineering (CAD/CAE) design and modeling flows do not yet take into account these real-world metal geometries. Variations in impedance and crosstalk associated with real profiles versus rectangular idealizations are identified for some typical cases and a computational procedure is discussed which may efficiently address this problem. [ABSTRACT FROM AUTHOR]
- Published
- 2005
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