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Germanium (Ge) and silicon-germanium (Si-Ge) have the potential to integrate optics with Si IC technology. The quantum-confined Stark effect, a strong electroabsorption mechanism often observed in III-V quantum wells (QWs), has been demonstrated in Si-Ge/Ge QWs, allowing optoelectronic modulators in such group IV materials. Here, based on photocurrent electroabsorption experiments on different samples and fitting of the resulting allowed and nominally forbidden transitions, we propose more accurate values for key parameters such as effective masses and band offsets that are required for device design. Tunneling resonance modeling including conduction band nonparabolicity was used to fit the results with good consistency between the experiments and the fitted transitions. [ABSTRACT FROM PUBLISHER]

We monolithically integrated polycrystalline GaAs metal-semiconductor-metal (MSM) photoconductive switches with a completely fabricated Si-CMOS amplifier and obtained a properly functional optical receiver, without altering the Si circuit performance. To our knowledge, this is the first time a fully monolithic on-chip integration has been achieved. [ABSTRACT FROM PUBLISHER]

In this paper, we introduce a robust monolithic integration technique for fabricating photonic integrated circuits comprising optoelectronic devices (e.g., surface-illuminated photodetectors, waveguide quantum-well modulators, etc.) that are made of completely separate epitaxial structures and possibly reside at different locations across the wafer as necessary. Our technique is based on the combination of multiple crystal growth steps, judicious placement of epitaxial etch-stop layers, a carefully designed etch sequence, and self-planarization and passivation steps to compactly integrate optoelectronic devices. This multigrowth integration technique is broadly applicable to most III-V materials and can be exploited to fabricate sophisticated, highly integrated, multifunctional photonic integrated circuits on a single substrate. As a successful demonstration of this technique, we describe integrated photonic switches that consume only a 300 ×300 μm footprint and incorporate InGaAs photodetector mesas and InGaAsP/InP quantum-well modulator waveguides separated by 50 μm on an InP substrate. These switches perform electrically-reconfigurable optically-controlled wavelength conversion at multi-Gb/s data rates over the entire center telecommunication wavelength band. [ABSTRACT FROM PUBLISHER]

A novel electrically controlled tunable metal-semiconductor-metal (MSM) photodetector is introduced and experimentally demonstrated with 2.5-ns wavelength-switching access time on a GaAs chip for switching between two wavelengths. This detector has a demonstrated 20.1-dB ON/OFF contrast ratio between the selected and the rejected wavelength and can resolve 179-GHz spaced wavelength-division multiplexing channels. In addition, device wavelength switching is achieved with a differential input voltage swing of ±1.65 V. This low bias voltage makes it compatible with complementary metal-oxide semiconductor (CMOS) control electronics for rapid switching. [ABSTRACT FROM PUBLISHER]

Traditional optical-electronic-optical (o-e-o) conversion in today's optical networks requires cascading separately packaged electronic and optoelectronic chips and propagating high-speed electrical signals through and between these discrete modules. This increases the packaging and component costs, size, power consumption, and heat dissipation. As a remedy, we introduce a novel, chip-scale photonic switching architecture that operates by confining high-speed electrical signals in a compact optoelectronic chip and provides multiple network functions on such a single chip. This new technology features low optical and electrical power consumption, small installation space, high-speed operation, two-dimensional scalability, and remote electrical configurability. We present both theoretical and experimental discussion of our monolithically integrated photonic switches that incorporate quantum-well waveguide modulators directly driven by on-chip surface-illuminated photodetectors. These switches can be conveniently arrayed two-dimensionally on a single chip to realize a number of network functions. Of those, we have experimentally demonstrated arbitrary wavelength conversion across 45 nm and dual-wavelength broadcasting over 20 nm, both spanning the telecommunication center band (1530-1565 nm) at switching speeds up to 2.5 Gb/s. Our theoretical calculations predict the capability of achieving optical switching at rates in excess of 10 Gb/s using milliwatt-level optical and electrical switching powers. [ABSTRACT FROM PUBLISHER]