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Researchers from Henan University of Technology in China have conducted a study on nanostructured compliant interconnections for advanced micro-electronic packaging. The study addresses the challenges posed by the miniaturization and enhanced functionality of micro-electronic devices, such as thermal expansion differences and non-planar substrates. Nanostructured compliant interconnections have emerged as a promising solution to manage these issues and improve the performance and mechanical reliability of interconnections. The study also discusses advanced bonding techniques and provides insights into future developments in this field. For more information, readers can refer to the journal article published in Materials & Design. [Extracted from the article]