Search

Reports on the collaboration between Advanced Micro Devices Inc., Infineon and United Microelectronics Corp. to develop a common 65 and 45nanometer manufacturing platform. Benefits of the collaboration to the companies; Goal of the development of the manufacturing platforms; State of the electronics industry in the U.S.

The article offers information on the professional career of Jack Gifford, founder of Maxim Integrated Products Inc. in the U.S. He attended University of California in Los Angeles (UCLA) on a baseball scholarship and worked at Fairchild Corp. He partners with his former Fairchild colleague Jerry Sanders to establish AMD where he served as chief finance officer. Gifford founded Maxim and acted as the company's chief executive officer (CEO) until his retirement in 2007.

The article reports on the agreement between Intel Corp. and Hitachi Global Storage Technologies to develop and provide solid-state drivers (SSDs) for workstations, servers and storage arrays in the U.S. According to the companies, the products will be compatible with the traditional rotating-media drives manipulating applications that require demand high reliability and, interoperability (I/O) performance, and power consumption reduction. The first product is expected to be released by 2010.

The article reports that Avnet Inc. has deepened its relationship with Sun Microsystems and the value-added reseller community. Avnet announced that its enterprise computing products distribution operating group Avnet Technology Solutions is expanding its work with Sun in North America. Avnet will now serve as the value-added distributor for Sun for Oracle technologies.

The article reports that Semiconductor Research Corp. and the U.S. Commerce Department's National Institute of Standards and Technology announced a public-private partnership to support research to find a next-generation replacement for CMOS semiconductor technology. The partnership will fund a variety of high-priority research projects identified by the Nanoelectronics Research Initiative (NRI), which coordinates research in nanoelectronics among major universities across the U.S.

This article reports on a partnership established by Intel Corp. with the Oregon Health and Science University. This partnership is aimed at the assessment and intervention of age-related conditions. Through a $1 million grant, given by Intel and renewable up to three years, researchers will focus on improving the quality of life of the country's aging population by developing behavioral marker technologies that help to sense changes in behavior.

The article reports on issues and events related to the electronics industry in the U.S. The competition between Nintendo and Sony Corp. in the gaming platforms continues. Intel and Siemens have partnered to create VoIP solutions. Apple Computer Inc. has announced its planned set-top box. Patricia Dunn has been demoted to director at Hewlett-Packard.

The article reports on the proactive strategy embarked by Intel Capital, which involves larger investment stakes and more active collaboration, much of which will focus outside the U.S. in 2006. In 2005, Intel Capital announced the formation of a series of geographic investment fund outside the U.S. According to Intel Capital Arvind Sodhani, the company will be more proactive in areas of investment rounds, active board collaboration and taking larger investment stakes in portfolio companies.

The article reports on the partnership of Spansion with Analog Devices Inc. (ADI) to combine its Known Good Die flash memory with the Blackfin processor of ADI in a multi-chip module for products supporting the automotive market in the U.S. in 2006. The combined solution aims to deliver the storage capacity and performance required to allow reliable, fast boot-up and data storage for feature-rich radio, driver assistance, telematics and navigation systems.

The article reports on the appeal from Hector Ruiz, chairman and CEO of Advanced Micro Devices, for the U.S. Congress to take action on the American Innovation Initiative that would help companies compete effectively in the international market. According to Ruiz, the government should use the model of fair competition in its procurement practices. He also calls for private sector leaders to create collaborative partnership with other leaders in business, government and academia. He also stresses that the country should encourage competitiveness in other countries.

The article reports on the partnership of Phyworks Ltd. with Jazz Semiconductor in the U.S. in 2005. The prime objective of the partnership is to develop next-generation physical layer products for various wireless networks using the Silicon Germanium Bi-complementary metal-oxide semiconductor processes. Transimpedance amplifiers and high integrated laser drivers are among the type of high-speed networking integrated circuits to be developed by Jazz. Paul Kempf, chief technical officer and strategy officer at Jazz, comments on the partnership.

Reports on the partnership of University of California (UC) along with U.S. universities and Indian institutions led by Amrita University, to implement science and engineering education in India over a satellite electronic learning network as of July 25, 2005. Reaction of Gretchen Kalonji, director of international strategy development for the UC office of the president, to the partnership; U.S. universities that will encourage engineering faculty to spend a portion of their sabbatical at Amrita in the southern Indian state of Tamil Nadu; Research centers in the U.S. which are partners in the agreement.

Reports on the possibility that cellular operators engaging with WiMax could cause market changes in the U.S., according to the 2005 data from Oyster Bay, New York-based ABI Research. Partnership of Sprint with Motorola to trial WiMax; Conclusion of a Wimax trial conducted by O2 in Ireland; Causes of cellular network congestion according to Alan Varghese, principal analyst of semiconductor research at ABI Research.

Reports on a collaboration between Xilinx Inc. and ISR Technologies to demonstrate a fully operational software-defined radio that uses filed programmable gate arrays in the U.S. Terms of the deal; Features of the software radio; Significance of the software radio to the aerospace and defense divisions of Xilinx.

Reports on a partnership formed by Office Depot and Hewlett-Packard (HP) to create the first free national, in-store electronics recycling program in the U.S. Terms of the deal; Background on a range of products to be included in the recycling program; Significance of the program to HP.

Reports on the partnership of Honeywell with Cypress Semiconductor to produce a radiation-hardened silicon-on-insulator technology in the U.S. Products of Honeywell that are currently available; Challenges faced by the microchip industry in terms of chip size; Information on a space program to be implemented by the U.S. Department of Defense.

Presents a global update on electronic industries as of August 2003. Collaboration between ASIC player Kawasaki Microelectronics and Core Sim Inc., a design analysis and validation company; Demand in the U.S. dynamic random access memory spot sector; Market conditions of Europe's semiconductor industry.

Discusses the possibility that immersion lithography may push out the necessity of adopting extreme ultraviolet (EUV) lithography, based on a report by International Sematech. Impact on the need for EUV technology; Information on Sematech's New York lithography program in conjunction with its partner, the University of Albany; Issue on immersion lithography and deep ultraviolet lithography.

Deals with the venture of Infineon Technologies AG into biotechnology with the availability of Flow-Thru biochips and a matching complete bio-analysis systems which it will market with its U.S. partner company MetriGenix Incorporated. Target position of Infineon as a manufacturer by 2007; Comments from Infineon North America President Robert LeFort; Background on the technology offerings of Infineon.

Presents an update on various issues related to the U.S. electronics industry as of October 21, 2002. Terms of a distribution contract that have been awarded by Tyco International Ltd. to Richardson Electronics Ltd.; Details of the partnership between Boundless Corp. and Arrow Electronics Inc.; Distributors that have signed into an agreement with Summit Design Inc.

Presents news on the electronics industry in the U.S. as of August 2002. Partnership between Richardson Electronics and Technosystem Digital Networks; Creation of regional chief executive positions for Memec PLC; Information on reseller agreement between Chipdata and TrilogicEDA.

Presents news briefs on the semiconductor industry in the U.S. as of June 2002. Companies that are partnering to jointly develop advanced photomask technologies; Countersuit filed by Boxer Cross Inc. against Therma-Wave Inc.; Atomic layer deposition process for high-k dielectric films developed by Samsung Semiconductor Inc.

Presents news briefs on the electronic industries in the United States as of May 7, 2001. Release of XENON chips that combine voice and data traffic in metro area networks by PMC-Sierra Inc.; Partnership between Xilinx Inc. and Applied Micro Circuits Corp. to provide a multiprotocol interface for 10Gbit/sec communication networks in metro regions.

Presents news briefs on electronic industries in the United States as of April 23, 2001. Development of a solder-bumping process for 300mm wafers by Semitool Inc. and the Semiconductor Equipment Consortium for Advanced Packaging; Plans of Ericsson Inc. and Sony Corp. to partner in the mobile phone handset business; Details on a conference call for the release of the quarterly earnings of Jaco Electronics Inc.

Presents news briefs on the electronics industry in the United States as of October 16, 2000. Implication of the partnership formed by TTI Inc. with Bourns Inc. and Kemet Electronics Corp.; Sale of K*TEC Electronics to Thayer-Blum Funding II LLC.

Focuses on the operations of business-to-business (B2B) companies in the United States in 2000. Expansion of electronic commerce start-ups; Reason electronic companies would want to participate at Electronic Distribution Show and Conference; Information on some partnerships.

Presents news briefs about the semiconductor packaging industry as of May 1, 2000. March 2000 increase of the book-to-bill ratio in the United States printed wiring board industry; Partnership between Amkor Technology Inc. and Zuken USA Inc.; Semiconductor assembly subcontractor which ordered ball bonders from Kulicke & Soffa Industries Inc.

Reports on the business partnership of Credence Systems Corp. and Silicon Image in California. Importance of the relationship in the test and measurement of semiconductors; History of the partnership; Benefits of the relationship to Credence and Silicon Image.

Presents news briefs on the semiconductor industry in the United States (US) as of April 2000. Extension made by Philips Semiconductors company on its partnership with Zayante; Cores selected by the US Jet Propulsion Laboratory for use in the NASA/JPL Advanced Deep Space Systems Technology program; Features of the monitor developed by NEC Electronics Inc.

Presents news briefs on the semiconductor industry in the United States as of February 7, 2000. Features of the digital signal processors developed by Analog Devices Inc.; Purpose of Alcatel and STMicroelectronics company in forming a partnership; Capabilities of 21Z01 OctalPHY transceiver chip of AaNetCom Inc.

Reports developments of TeraLogic Inc in the United States during the Commercial Electronics Show. Partnership with Mitsubishi Electric Corp. for deployment of digital television; Addition of Personal Video Recorders (PVR) features to televisions; Expansion of support for data broadcasting over broadband networks.

Reports developments related to electronics in the United States as of January 2000. Partnership of Applied Materials Inc with Integrated Systems Engineering for development of device simulation package; Announcement of order for supply of assemblies by Micronetics Wireless Inc; Improvement of the financial results by Asyst Technologies.

Reports developments related to electronic business in United States as of January 2000. Partnership of USA Digital Radio Inc. with Analog Devices Inc. for integration of software; Introduction of digital- to-analog converter from Burr-Brown Corp; Licensure plan for GemCore technology by Smart-Card solutions.

Reports on partnerships between electronic companies in the United States. Partnership between New Vision Systems and Nissei Sangyo America Ltd.; Agreement between Veeco Instruments Inc. and Monarch Labs Incorporated.

Presents news briefs on the semiconductor industry in the United States as of July 26, 1999. Purpose of SZ Testsysteme Inc. in forming partnership with BridgePoint Technical Manufacturing Inc.; Acquisition of a stake from Systems Integration unit of FICO America Inc. by Micro Component Technology Inc.

Presents news briefs concerning the semiconductor industry in the United States. Purpose of the partnership formed by VEBA Electronics Group and OrCAD Inc.; Terms of the distribution agreement signed by Pioneer-Standard Electronics Inc. with T.sqware Inc.; Representative firms selected by Bourns Inc. for its North American sales network.

Presents news briefs on the semiconductor industry in the United States in May 1999. Aim of the partnership between Ramtron International Corp. and Ulvac Japan Ltd.; Details on a study being done by Kline & Co. called `The Global Outlook for Dielectric Materials in Semiconductor Devices, 1999-2004'; Information on the market for low-k dielectrics.

Elaborates the partnership between the original equipment manufacturers (OEM) and the electronic manufacturing services (EMS) providers in the United States. Analysis of areas of competence; Scope of product responsibility; Requirements for the success of the partnership.

Reports on the emergence of alliances among electronic companies as a result of the increasing request for proposals (RFP) for interactive multimedia services from telephone and cable companies. Microsystems Inc. and Thomson Consumer Electronics SA; Digital Equipment Corp. and General Instrument; Asynchronous transfer mode (ATM) broadband networking through satellite transmission.