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The article reports on the input and output interfaces. Topics discussed include consumer and video interfaces like DisplayPart, High-Definition Multimedia Interface (HDMI), and Thunderbolt. Also being discussed are the inductrial interfaces like ethernet, foundation field bus, and modbus, along with chip, printed circuit board (PCB), and backplane interfaces.

The article reports on 100 Gigabit Ethernet (100 GbE). Topics discussed include metal-oxide varistors (MOVs), use of MOVs for protection of sensitive circuits from a variety of overvoltage conditions, and High-speed-serial (HSS) technology. Also being discussed are activation of 25+ Gb/s on printed circuit boards (PCBs) by HSS.

The article offers information regarding the development of system-on-chip (SoC) based printed circuit boards (PCBs). It highlights the capabilities and challenges linked with SoC-based circuit boards to the manufacturing process. The development of an effective plan for designing, developing, testing, and producing the final PCBs is mentioned.

The article looks at the improvements made in printed-circuit-board (PCB) materials, which were motivated by the needs of electronic designers for military applications. It discusses the reliance of military circuit and system designers on high-performance circuit materials to obtain greater functionality from circuits that are smaller, lighter, and less expensive. A study conducted by circuit-materials supplier Rogers Corp. on PCB materials is presented.

The article discusses the key elements that will help ensure successful design in printed-circuit boards (PCBs). PCBs are regarded as the central nervous system for most electronics assemblies. The first element is the concept stage involving the collaboration of the circuit designers with PCB designers on technology evaluation. Next, it is emphasized that circuit design teams must clearly communicate with PCB design teams mainly for the design intent. The design-creation stage is considered, where it involves engineers who will move into final component selections and creation of their libraries. Discussions on the use of simulation tools, limitations of simulation, and the step to lay out the circuit for physical prototyping are provided.

Discusses the factors to consider in designing a high performance backplanes. Importance of backplanes in a computer system; Applications of backplanes; Three factors to be consider in choosing backplanes.

The article focuses on the advances in complaint-pin connector technology or the ball grid array-class (BGA) that led to a dramatic reduction in printed-circuit board (PCB) through-hole diameter requirements. It states that the next generation devices retain the traditional assembly and operational advantages of press-fit connectors while achieving electrical performance. It provides information on the electrical features and benefits as well as its improved circuit design and flexibility. A comparison between other press-fit connector technologies as well as the distinct mechanical advantages and its compatibility with surface area are also presented.

This article focuses on technologies used in the manufacture of printed circuit boards. While pc-board production hasn't changed much since then, dozens of companies now provide fast turnarounds for prototypes and small production runs. These new products provide an alternative to farming out this messy process. Now along come the ProtoMatS62 and Pro-Conduct, which represent other similar products. The solution, developed by LPKF Laser and Electronics AG, comprises two parts. The ProtoMat62 removes the copper, and ProConduct fills in the holes, or rather, plates the holes. Multilayer boards are built in the usual fashion, by stacking a set of boards. ProConduct is then applied to the stack. The process is fast and clean, making it possible to create boards in-house. In-house pc-board generation offers a number of advantages. It significantly reduces turnaround time, speeding up time-to-market for the final product. Another major reason why companies prefer in-house pc-board creation concerns security and proprietary requirements. The ProtoMat S62 is a plotter milling machine designed to very tight tolerances.

Provides a list of printed-circuit-board connector manufacturers in the United States which was originally published in the February 5, 1996 issue of `Electronic Design.'

The article reports on the use of high-density interconnect (HDI) technology for printed-circuit board (PCB) designers to help them design products that are 50 percent smaller. It states the HDI technology will help improve the PCB board designs in terms of routing density and thermal and electrical characteristics. Different configurations of the PCB vias including through-hole (TH), buried, blind and microvias are also presented.

The article offers tips for designing lead-free components for printed circuit boards. Manufacturer should take into account that the packaging, thermal characteristics, and footprints of eutectic and lead-free components can be different, and these differences can be the basis for errors. Component footprints, package types, and associated component spec sheets should be studied carefully during the pc-board layout process. Lead free components should be specified in the assembly drawing and instructions should include how engineering change orders should be addressed.

The article presents strategies for power management of light emitting diodes (LED) in a liquid crystal display (LCD) backlight system. LED backlighting systems usually involve handheld devices with a LED drive circuit powered by a battery whose output voltage varies over time, thus, an optimum LED driver design is required. The requirements for an optimum LED driver design includes the battery type, LCD characteristics, LED driver integrated circuit and its external components, printed-circuit-board layout and component placement, possible noise generated by the LED driver and radio frequency immunity in cellular phone applications. Furthermore, power requirements affect LED brightness and efficiency, thus, this also needs proportional attention.

The article offers information about the implementation of field programmable gate array (FPGA) designs. In the implementation of FPGA, whether it be individual or as a team, it is advised that one must plan escape routes early in order to avoid multiple downstream iterations and a possibly unroutable printed-circuit board. During planning, one can seek the help of a system designer or layout engineer early to determine component placement so the appropriate region or bank and lock pin assignments are determined earlier. Finally, constraining the signal assignments during planning can make the bits appear sequentially on adjacent pins where possible.

Reports that flexible-circuit production experienced a market climb in 1995. Statistics; Market trends.