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Your search keyword '"Hyungsoo Kim"' showing total 5 results
Start Over Author "Hyungsoo Kim" Journal electrical performance of electrical packaging (ieee cat. no. 03th8710)
5 results on '"Hyungsoo Kim"'

1. Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Author

JongKuk-Hong, Joungho Kim, Youngsoo Hong, SeokKyu-Lee, Youchul Jeong, Hyungsoo Kim, and Jongbae Park

Subjects
Engineering, business.industry, Equivalent series inductance, Electrical engineering, Impedance matching, Hardware_PERFORMANCEANDRELIABILITY, Decoupling capacitor, law.invention, Inductance, Capacitor, Film capacitor, law, Hardware_INTEGRATEDCIRCUITS, Output impedance, business, Electrical impedance
Abstract

Significant reduction of power/ground inductive impedance and SSN suppression was successfully demonstrated by using embedded capacitor film in high performance package and PCB up to 3GHz frequency range. The reduction of the inductance impedance and SSN are acquired by the help of reduced via inductance in the embedded film capacitor.

Published
2003

2. Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Author

Hyungsoo Kim, Jongbae Park, Joungho Kim, Youchul Jeong, and Jingook Kim

Subjects
Engineering, Noise temperature, Noise generator, business.industry, Phase noise, Electronic engineering, Effective input noise temperature, Time domain, business, Noise floor, Jitter, Ground plane
Abstract

Various noise isolation methods for low jitter on the power/ground plane are thoroughly analyzed and a new method is proposed. We analyzed using both frequency and time domain measurement methods and the results were verified by jitter measurements.

Published
2003

3. Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

Author

Jun So Pak, Hyungsoo Kim, Junwoo Lee, and Joungho Kim

Subjects
Coupling, Modeling and simulation, Engineering, Plane (geometry), business.industry, Electronic engineering, Radiation, business, Signal, Resonance (particle physics), Computational physics, Ground plane, Power (physics)
Abstract

We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.

Published
2003

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