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Start Over Author "Wahl, Jeremy A." Journal ecs transactions
3 results on '"Wahl, Jeremy A."'

1. (Invited)Extending Advanced CMOS Scaling with SiGe Channel Materials

Author

Carter, Rick J, primary, Sporer, Ryan, additional, McArdle, Timothy J, additional, Mulfinger, George Robert, additional, Holt, Judson Robert, additional, Beasor, Scott, additional, Child, Amy, additional, Fronheiser, Jody, additional, Wahl, Jeremy A, additional, Geisler, Holm, additional, Kluth, George J, additional, Triyoso, Dina H, additional, Punchihewa, Kasun, additional, Rana, Uzma, additional, Vanamurthy, Laks, additional, and Sohn, D K, additional

Published
2018
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2. (Invited) Factors Impacting Threshold Voltage in Advanced CMOS Integration: Gate Last (FINFET) vs. Gate First (FDSOI)

Author

Triyoso, Dina, primary, Carter, Rick, additional, Kluth, Jon, additional, Luning, Scott, additional, Child, Amy, additional, Wahl, Jeremy, additional, Mulfinger, Bob, additional, Punchihewa, Kasun, additional, Kumar, Anil, additional, Kang, Laegu, additional, Sporer, Ryan, additional, Chen, Xiaobo, additional, Straub, Sherry, additional, Bohra, Girish, additional, Patil, Suraj, additional, Zhang, Xing, additional, Chen, Alex, additional, Togo, Mitsuhiro, additional, and Pal, Rohit, additional

Published
2015
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3. (Invited) Extending Advanced CMOS Scaling with SiGe Channel Materials

Author

Carter, Rick J, Sporer, Ryan, McArdle, Timothy J, Robert, George, Robert, Judson, Beasor, Scott, Child, Amy, Fronheiser, Jody, Wahl, Jeremy A, Geisler, Holm, Kluth, George J, Triyoso, Dina H, Punchihewa, Kasun, Rana, Uzma, Vanamurthy, Laks, and Sohn, D K

Abstract

Advanced CMOS Scaling has benefited from the introduction of novel materials and integration techniques over the past two decades. Consumer demand for more connectivity and real-time information continues to drive the need for product solutions with advanced power management and increased functionality while maintaining low cost. New device architectures such as FINFET and Fully Depleted Silicon-On-Insulator are part of the solution, however these device architectures still rely on advanced channel strain engineering to meet power, performance, and scaling requirements. The use of SiGe as a channel material is attractive due to enhanced mobility and compatibility with standard CMOS processing. PFET drive current enhancement has already been realized to enable platforms based on high performance planar FDSOI devices, while SiGe as part of the channel is also a top solution to enable next generation FINFET and Gate-All-Around devices. In this invited paper we will provide a look into the device benefits and challenges of SiGe as a channel material.

Published
2018

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