6 results on '"LINDNER, PAUL"'
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2. Wafer Bonding for Backside Illuminated Image Sensors
3. Low Temperature Bonding with Thin Wafers for 3D Integration
4. Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes
5. Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
6. Plasma Activated Wafer Bonding as an Alternative to Standard Wafer Bonding Processes
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