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Start Over Author "Hurtubise, R." Journal ecs transactions
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2. Electroless Copper Deposition on Ruthenium for Damascene Interconnects

Author

Chen, Qingyun, Lin, Xuan, Valvede, C., Paneccasio, V., Hurtubise, R., Ye, P., Kudrak, E., and Abys, J.

Abstract

Nucleation and growth behavior of electroless copper on different Ru substrates, PVD Ru and CVD/ALD Ru, were investigated. Possibility of using electroless copper as seeding on Ru followed by ECP gapfill and as direct gapfilling for damascene interconnect applications was explored. Effect of Ru substrate microstructure on electroless copper grain orientation and texture was discussed.

Published
2007
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