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5. New Approach to Surface Voltage Based Non-Visual Defect Inspection

Author

Marinskiy, Dmitriy, Lagowski, Jacek, Wilson, Marshall, Findlay, Andrew, Almeida, Carlos, and Edelman, Piotr

Abstract

Measurement speed and resolution of surface voltage based non-visual defect inspection are examined. There is a tradeoff between high measurement speed in whole wafer inspection which requires a larger measurement probe and resolution of the method which requires a smaller measurement probe. In this paper we overcome this tradeoff by using different diameter Kelvin probes. Full wafer inspection is performed using a 2mm diameter Kelvin probe enabling high throughput. Only when a suspected failure is detected, an inspection of a localized smaller area is performed with a 10 μm diameter Kelvin probe.

Published
2014
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