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Diamond/Ag–Ti composites were fabricated by a low-cost liquid sintering technique. The Ti addition can effectively improve wetting and promote penetration in composite pores during liquid sintering. The interface structure of the diamond/Ag–Ti composite was identified as Ag/TiC/Ag–Ti/diamond. A high thermal conductivity of 719 W/mK was obtained for the 50 vol.% diamond/Ag-1 at.% Ti composite. Using a bimodal mixture (60 vol.% 150 μm + 10 vol.% 50 μm diamond/Ag-2 at.% Ti composite), a low coefficient of thermal expansion of 6.3 × 10 − 6 /K still with high thermal conductivity of 687 W/mK was achieved. These composites have potential applications for thermal management of high integration electronic devices.

Thermal management in microelectronic technology has become an important issue due to the increase of device power and integration levels. Diamond and silver were selected for the fabrication of composites with high thermal conductivity and low coefficient of thermal expansion (CTE). Diamond reinforcement powders with varied types, shapes and sizes were electroless plated by silver. Then these powders were hot-pressed in air at 600 °C, 500 MPa for 30 min to produce bulk silver matrix composites. The thermal conductivity and the CTEs of the composite at 20 vol.% are 420 W/m K and 12 ppm/K, respectively. These diamond/Ag composites have potential applications for the high integration electronic devices.