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Polymer composites with high thermal conductivity possess light weight, easy process and high chemical resistance, which has a huge demand in electronic packaging fields. Therefore, the development of new filler for improving the thermal conductivity has attracted lots of attentions in the field of polymer composites. In this work, a new hybrid filler was prepared through depositing nano-crystalline diamonds on SiC nanowires by hot filaments chemical vapor deposition . The results of SEM and TEM characterizations showed that the filler has a novel structure which is similar as a string of “sugar-coated haws on a stick” (a kind of Chinese candied fruit, named Tanghulu). Polymer composites containing the filler with the Tanghulu-like structure presented the high thermal conductivity of 0.57 W m −1 K−1 under 25 wt% filler contents. The excellent thermal conduction performance is attributed to the regional continuous networks formed by filler with the Tanghulu-like structure. Infrared images and a cooling radiator were utilized to further confirm the high thermal transportation performance of the polymer composites. The development of Tanghulu-like diamond@silicon carbide nanowires proposes a new strategy to prepare polymer composites with enhanced thermal conductivity, which will further promote the application in electronic packaging fields.

Highly thermally conductive polymer composites with over 10 W m−1 K−1 are widely pursued in the commercial field. Unfortunately, the polymer composites with high thermal conductivity are few reported using simple and scalable methods to meet the commercial demands. Therefore, herein highly thermal conductive polymer composites consisting of hydroxyl-rich nanodiamonds (ND-OH) and poly(vinyl alcohol) (PVA) are reported, which exhibits the interfacial properties of composite is closely related to its thermal conductivity. It proves that interface strength between matrix and filler would dominate the thermal conductivity of composite at a relatively low content. While the thermal conductivity would be dominated by the filler-filler interaction at high loadings. The ultrahigh thermal conductivity of the PVA/ND-OH composite is 18.98 W m−1 K−1 when ND-OH reach at 90 wt%. The polymer composites present the excellent thermal conductivity and show a potential application for thermal management of the next-generation electronic products.

In virtue of its excellent performance and abundant surface terminations, MXenes, a newly emerged 2D materials, greatly exhibit promising applications in many fields of energy storage and electromagnetic shielding. Ti3C2, a member of MXenes, is widely investigated in recent years. However, lack for attention in thermal property and corrosion behavior. Here, Copper matrix composites were prepared by Spark Plasma Sintering, in which TiC and few-layer Ti3C2 nanosheets as filler. The results exhibit corrosion resistance of the Ti3C2/Cu composites were improved compared to TiC/Cu composites, benefiting from outstanding electrical conductivity and easily oxidized property of Ti3C2. However, the thermal conductivity of Ti3C2/Cu composite with the content of 2 wt% Ti3C2 improves about 15% compared to TiC/Cu composites with same content, resulting from the low inherent thermal conductivity of filler and lattice mismatch between copper and filler. Moreover, the electrical resistance of Ti3C2/Cu composites increases about 100% with the content of 2 wt% Ti3C2 at interfacial contact resistance measurement compared with pure Cu. Meanwhile, the anti-corrosion performance of the Ti3C2/Cu composites was improved over pure Cu. This work will broaden appliance field of Ti3C2 and lay the foundation for the future research.