Search

The 35Cl n.q.r. spectra of a series of tin(IV) chloride adducts SnCl4·2L [L = MeCN, CH2CHCN, ButCN, PhCN′ CH2(CN)2, 1,2-C6H4(CN)2, SMe2O, or tht (tetrahydrothiophen)] have been recorded at various temperatures and used to deduce whether these complexes are cis or trans. A trans structure is indicated for SnCl4·2tht, cis structures for the remainder. When compared with other published n.q.r. and structural data, our results indicate that the 35Cl n.q.r. frequencies are related to the Sn–Cl bond lengths in such systems. The higher 35Cl n.q.r. frequencies tend to be associated with the shorter bonds, though the frequencies also vary markedly with temperature.

In condensation reactions of 2,3,5-tri-O-benzoyl-D-ribofuranosyl acetate with various kinds of enol silyl ethers in the presence of tin(IV) chloride, the acetate behaves as an ambident electrophile to give two types of products arising from nucleophilic attack of the enol ether on C-1 carbon of the ribose derivative and on carbonyl carbon of 2-benzoyloxyl group, depending remarkably on the enol silyl ethers.

Experiments were conducted which show that Sn(IV) bound to a substrate is capable, in conjunction with Pd(II), of catalyzing Ni‐P plating and that this effect can be inhibited by u.v. light. Some of the parameters affecting the quality of the plating and u.v. inhibition were determined. It was also found that in order for u.v. irradiation to inhibit Ni‐P plating, the radiation must be applied after the Pd(II) activation step. In the case of copper, however, plating occurs only on the irradiated area of the catalyst. A mixture of Sn(IV) and Pd(II) was also found to catalyze Ni‐P plating. The behavior of the catalyst deposited by this mixture was quite similar to that of the catalyst present after Pd(II) activation following Sn(IV) sensitization in the stepwise procedure.