1. Multiscale design and digital light processing preparation of high-strength SiOC ceramic metastructures for tuning microwave absorption properties.
- Author
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Wang, Zhicheng, Wang, Chaoyang, Tang, Jie, She, Yulong, Huang, Zhengren, Li, Quan, Yang, Jian, and Yang, Yong
- Subjects
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HONEYCOMB structures , *MICROWAVES , *MINIMAL surfaces , *ABSORPTION , *THREE-dimensional printing , *CERAMICS - Abstract
Silicon oxycarbide (SiOC) ceramics have been used to fabricate microwave-absorbing metastructures, demonstrating impressive absorption capabilities. However, SiOC ceramic metastructures with excellent performance require simple fabrication processes and appropriate mechanical and electromagnetic properties. In this study, a solvent-free photosensitive polysiloxane preceramic was developed by blending methoxy/hydroxy polysiloxanes with acrylates, with a ceramic yield of over 60% after curing using a novel two-step ultraviolet (UV)/thermal method. The composition and microstructure of SiOC ceramics can be designed by controlling the preceramic composition. Dense, crack-free gyroid-shellular shaped triple periodic minimal surface (GS-TPMS) electromagnetic metastructures were fabricated using digital light processing (DLP) 3D printing technology. By designing the porosity of the GS-TPMS structure to 51%, an effective absorption bandwidth that covers the X-band can be achieved at a thickness of 3.1 mm. The honeycomb structure, with a geometric density of 0.69 g/cm3, exhibited a high compressive strength of 107.05 MPa. This paper presents an efficient approach for the prompt and customized fabrication of lightweight ceramic metastructures with outstanding microwave absorption properties. • A solvent-free polysiloxane/acrylate hybrid preceramics is developed for 3D printing. • The UV/thermal two-stage treatment achieved cross-linking curing of the preceramics. • Multiscale design of SiOC ceramics for enhanced microwave absorption properties. • SiOC ceramic metastructures with effective absorption in the X-band are prepared. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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