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The strength of diamond films prepared by chemical vapor deposition (CVD) is usually much lower than that of natural-type IIa single-crystal diamonds. In this work, the fracture strength of free-standing diamond films deposited by direct current arc plasma jet CVD has been examined by conducting three-point bending experiments. The results obtained for both the polished and as-grown samples were in good agreement with a well-known Hall–Petch equation describing the relationship between the fracture strength and grain size, indicating that grain refinement represented an effective way of improving the mechanical properties of CVD diamond films. Furthermore, the diversification of the crystalline texture of the films achieved by polishing apparently increased their fracture strength, which was inversely proportional to the film thickness. A theoretical method for estimating the fracture strength of free-standing CVD diamond films by approximating their intrinsic strength was proposed, whereas their fracture toughness was determined by conducting simplified four-point bending tests at room temperature, 25 °C, using a single-edge pre-cracked beam method.

In the present study, two types of diamond films with a diameter of 123 mm were deposited by DC arc plasma jet chemical vapor deposition (CVD) operating in the gas recycling mode. These two diamond films were found to possess peculiar grain family morphologies. The fracture strengths of the samples were 182.65 and 995.58 MPa, respectively. To investigate the possible reason for the large difference in the fracture strength between the samples, the surface and fracture morphologies of the two types of diamond films as well as their grain size were characterized. The results revealed that the sample with low fracture strength suffered from a typical intergranular fracture. Weak grain boundary, impurities distributed in the boundary, and low strength of diamond grains led to a decrease in the fracture strength. However, the sample with high fracture strength mainly suffered from transgranular fracture and the columnar grain exhibited numerous voids. Owing to the impact of twinning, the voids could be occupied, thus increasing the contact area between the adjacent grains. Moreover, large grain family on the growth side contained numerous small grains and twins. These small grains, twins on growth side along with the difference of stress on surfaces inhibit fracture strength from decreasing rapidly. All these features benefitted fracture strength. Moreover, when the sample was loaded, the tips located in the voids probably resulted in increase of risk of stress concentration, which might have led to initiation of crack origin and eventual fracture.